Impact of Isothermal Aging on Long-Term Reliability of Fine-Pitch Ball Grid Array Packages with Sn-Ag-Cu Solder Interconnects: Die Size Effects

2011 ◽  
Vol 40 (9) ◽  
pp. 1967-1976 ◽  
Author(s):  
Tae-Kyu Lee ◽  
Weidong Xie ◽  
Bite Zhou ◽  
Thomas Bieler ◽  
Kuo-Chuan Liu
Keyword(s):  
Size Effects ◽  
Isothermal Aging ◽  
Ball Grid Array ◽  
Solder Interconnects ◽  
Fine Pitch ◽  
Ball Grid Array Packages

Impact of Isothermal Aging on the Long-Term Reliability of Fine-Pitch Ball Grid Array Packages With Different Sn-Ag-Cu Solder Joints

2012 ◽  
Vol 2 (8) ◽  
pp. 1317-1328 ◽  
Author(s):  
Jiawei Zhang ◽  
Sivasubramanian Thirugnanasambandam ◽  
John L. Evans ◽  
Michael J. Bozack ◽  
Richard Sesek
Keyword(s):  
Isothermal Aging ◽  
Solder Joints ◽  
Ball Grid Array ◽  
Fine Pitch ◽  
Ball Grid Array Packages

Impact of isothermal aging on fine pitch BGA packages with Sn-Ag-Cu solder interconnects

2010 ◽  
Vol 2010 (1) ◽  
pp. 000298-000305
Author(s):  
Tae-Kyu Lee ◽  
Weidong Xie ◽  
Thomas R. Bieler ◽  
Kuo-Chuan Liu ◽  
Jie Xue
Keyword(s):  
Thermal Cycling ◽  
Microstructure Evolution ◽  
Isothermal Aging ◽  
Substrate Surface ◽  
Solder Interconnects ◽  
Surface Finishes ◽  
Bga Packages ◽  
Fine Pitch ◽  
Solder Balls

The interaction between isothermal aging and long-term reliability of fine pitch ball grid array (BGA) packages with Sn-3.0Ag-0.5Cu (wt%) solder ball interconnects are investigated. In this study, 0.4mm fine pitch packages with 0.3mm diameter Sn-Ag-Cu solder balls are used. Two different die sizes and two different package substrate surface finishes are selected to compare the internal strain impact and alloy effect, especially the Ni effect during thermal cycling. To see the thermal impact on the thermal performance and long-term reliability, the samples are isothermally aged and thermal cycled from 0 to 100°C with a 10minute dwell time. Based on weibull plots for each aging condition, the lifetime of the package reduced approximately 44% with 150°C aging precondition. The microstructure evolution is observed during thermal aging and thermal cycling with different phase microstructure transformations between electrolytic Ni/Au and OSP surface finishes, focusing on the microstructure evolution near the package side interface. Different mechanisms after aging at various conditions are observed, and their impacts on the fatigue life of solder joints are discussed.

Reliability Comparison of Aged SAC Fine-Pitch Ball Grid Array Packages Versus Surface Finishes

2015 ◽  
Vol 5 (6) ◽  
pp. 828-837 ◽  
Author(s):  
Zhou Hai ◽  
Jiawei Zhang ◽  
Chaobo Shen ◽  
John L. Evans ◽  
Michael J. Bozack ◽  
...  
Keyword(s):  
Ball Grid Array ◽  
Surface Finishes ◽  
Fine Pitch ◽  
Ball Grid Array Packages

scholarly journals Long-term Isothermal Aging Behaviors of V Modified 2.25Cr-1 Mo Steels

2005 ◽  
Vol 91 (12) ◽  
pp. 888-896 ◽  
Author(s):  
Hiroshi YAGUCHI ◽  
Shogo MURAKAMI ◽  
Nobuyuki FUJITSUNA ◽  
Tomohiko SHINYA ◽  
Masato YAMADA ◽  
...  
Keyword(s):  
Isothermal Aging
Sign in / Sign up

Export Citation Format

Share Document