Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy

2015 ◽  
Vol 45 (1) ◽  
pp. 764-770 ◽  
Author(s):  
M. Pourmajidian ◽  
R. Mahmudi ◽  
A. R. Geranmayeh ◽  
S. Hashemizadeh ◽  
S. Gorgannejad
Keyword(s):  
Solder Alloy ◽  
Creep Behavior ◽  
Lead Free ◽  
Impression Creep

Impression creep behavior of lead-free Sn–5Sb solder alloy

2007 ◽  
Vol 448 (1-2) ◽  
pp. 287-293 ◽  
Author(s):  
R. Mahmudi ◽  
A.R. Geranmayeh ◽  
A. Rezaee-Bazzaz
Keyword(s):  
Solder Alloy ◽  
Creep Behavior ◽  
Lead Free ◽  
Impression Creep

scholarly journals Creep behavior of eutectic Sn-Cu lead-free solder alloy

2002 ◽  
Vol 31 (7) ◽  
pp. 828-828 ◽  
Author(s):  
C. M. L. Wu ◽  
M. L. Huang
Keyword(s):  
Solder Alloy ◽  
Creep Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder

Creep behavior of eutectic Sn-Cu lead-free solder alloy

2002 ◽  
Vol 31 (5) ◽  
pp. 442-448 ◽  
Author(s):  
C. M. L. Wu ◽  
M. L. Huang
Keyword(s):  
Solder Alloy ◽  
Creep Behavior ◽  
Lead Free ◽  
Lead Free Solder ◽  
Lead Free Solder Alloy ◽  
Free Solder
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