Impression Creep Behavior of Zn-Sn High-Temperature Lead-Free Solders

2010 ◽  
Vol 39 (11) ◽  
pp. 2495-2502 ◽  
Author(s):  
R. Mahmudi ◽  
M. Eslami
Keyword(s):  
High Temperature ◽  
Creep Behavior ◽  
Lead Free ◽  
Impression Creep ◽  
Lead Free Solders

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders

2012 ◽  
Vol 19 (3) ◽  
pp. 31-36 ◽  
Author(s):  
Yong-Ho Ko ◽  
Taek-Soo Kim ◽  
Young-Kyu Lee ◽  
Sehoo Yoo ◽  
Chang-Woo Lee
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders

Interfacial Reactions of Si Die Attachment with Zn-Sn and Au-20Sn High Temperature Lead-Free Solders on Cu Substrates

2009 ◽  
Vol 38 (6) ◽  
pp. 873-883 ◽  
Author(s):  
Seongjun Kim ◽  
Keun-Soo Kim ◽  
Katsuaki Suganuma ◽  
Goro Izuta
Keyword(s):  
High Temperature ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Die Attachment ◽  
Cu Substrates ◽  
Lead Free Solders

Microstructure and Sn Crystal Orientation Evolution in Sn-3.5Ag Lead-Free Solders in High-Temperature Packaging Applications

2013 ◽  
Vol 43 (1) ◽  
pp. 57-68 ◽  
Author(s):  
Bite Zhou ◽  
Govindarajan Muralidharan ◽  
Kanth Kurumadalli ◽  
Chad M. Parish ◽  
Scott Leslie ◽  
...  
Keyword(s):  
High Temperature ◽  
Crystal Orientation ◽  
Lead Free ◽  
Sn Crystal Orientation ◽  
Lead Free Solders

Effect of Zn and Sb Additions on the Impression Creep Behavior of Lead-Free Sn-3.5Ag Solder Alloy

2015 ◽  
Vol 45 (1) ◽  
pp. 764-770 ◽  
Author(s):  
M. Pourmajidian ◽  
R. Mahmudi ◽  
A. R. Geranmayeh ◽  
S. Hashemizadeh ◽  
S. Gorgannejad
Keyword(s):  
Solder Alloy ◽  
Creep Behavior ◽  
Lead Free ◽  
Impression Creep

Impression Creep Behavior of Atmospheric Plasma-Sprayed and Hot Pressed MoSi2/Si3N4

1997 ◽  
Author(s):  
K.J. Hollis ◽  
D.P. Butt ◽  
R.G. Castro
Keyword(s):  
High Temperature ◽  
Grain Boundary ◽  
Creep Behavior ◽  
Grain Boundary Sliding ◽  
Atmospheric Plasma ◽  
Second Phase ◽  
Impression Creep ◽  
Creep Mechanisms ◽  
Boundary Sliding ◽  
Plasma Sprayed

Abstract The use of MoSi2 as a high temperature oxidation resistant structural material is hindered by its poor elevated temperature creep resistance. The addition of second phase Si3N4 holds promise for improving the creep properties of MoSi2 without decreasing oxidation resistance. The high temperature impression creep behavior of atmospheric plasma sprayed (APS) and hot pressed (HP) MoSi2/Si3N4 composites was investigated. Values for steady state creep rates, creep activation energies, and creep stress exponents were measured. Grain boundary sliding and splat sliding were found to be the dominant creep mechanisms for the APS samples while grain boundary sliding and plastic deformation were found to be the dominant creep mechanisms for the HP samples.

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