Thermal Conductivity Measurement of Thermoelectric Thin Films by a Versatility-Enhanced 2ω Method

2016 ◽  
Vol 46 (5) ◽  
pp. 3089-3096 ◽  
Author(s):  
Ryo Okuhata ◽  
Kentaro Watanabe ◽  
Satoaki Ikeuchi ◽  
Akihiro Ishida ◽  
Yoshiaki Nakamura
2006 ◽  
Vol 47 (8) ◽  
pp. 1894-1897 ◽  
Author(s):  
Haitao Wang ◽  
Yibin Xu ◽  
Masahiro Goto ◽  
Yoshihisa Tanaka ◽  
Masayoshi Yamazaki ◽  
...  

2006 ◽  
Vol 51 (23) ◽  
pp. 2931-2936 ◽  
Author(s):  
Zhen Chen ◽  
Juekuan Yang ◽  
Ping Zhuang ◽  
Minhua Chen ◽  
Jian Zhu ◽  
...  

Author(s):  
Taehee Jeong ◽  
Jian-Gang Zhu

Using the time–resolved thermoreflectance technique, the thermal conductivity of CoFe films are measured with various thicknesses and the results show a thickness-dependent thermal conductivity. In order to overcome the obstacle for the high thermal conductivity metal film measurement, a thermal barrier (SiNx) is added between the metal film and Si substrate.


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