Atomic Simulation of Crystallographic Orientation Effect on Void Shrinkage and Collapse in Single-Crystal Copper under Shock Compression

Author(s):  
Man Wang ◽  
Yanqiu Zhang ◽  
Shuyong Jiang
2010 ◽  
Vol 22 (6) ◽  
pp. 065404 ◽  
Author(s):  
W J Murphy ◽  
A Higginbotham ◽  
G Kimminau ◽  
B Barbrel ◽  
E M Bringa ◽  
...  

2018 ◽  
Vol 5 ◽  
pp. 15
Author(s):  
Man Zhao ◽  
Xia Ji ◽  
Beizhi Li ◽  
Steven Y. Liang

In the micro-grinding of single-crystal copper, the effect of crystallography becomes significant as the wheel works intra-crystalline. To quantify the effect of crystallographic orientation (CO) related to the cutting direction on the micro-grinding process, this article presents a Taylor factor model by examining the number and style of activated slip systems. Then, the flow stress model of monocrystalline material is developed considering the variation of the Taylor factor. Furthermore, the models of chip formation and rubbing forces are derived from the flow stress model, while the plowing force is predicted by the Vickers hardness. Then, the overall grinding force model of the whole wheel is developed by incorporating the process parameters and the wheel properties. Finally, micro-grinding experiments are conducted to verify the model, using only the Taylor factor as the variable. The proposed analysis is also compared with the previously reported model, which considers the Taylor factor as a constant of 3.06. The comparison between the two predictions and experimental data shows that the consideration of Taylor factor variability improves the accuracy of prediction.


1971 ◽  
Vol 32 (C1) ◽  
pp. C1-1061-C1-1063
Author(s):  
G. S. KRINCHIK ◽  
E. A. GANSHINA ◽  
V. S. GUSHCHIN

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