Thermal contact resistance estimation at the blank/tool interface: experimental approach to simulate the blank cooling during the hot stamping process

2010 ◽  
Vol 3 (3) ◽  
pp. 147-163 ◽  
Author(s):  
Bakri Abdul Hay ◽  
Brahim Bourouga ◽  
Christine Dessain
2015 ◽  
Vol 19 (4) ◽  
pp. 1369-1372 ◽  
Author(s):  
Zhe Zhao ◽  
Hai-Ming Huang ◽  
Qing Wang ◽  
Song Ji

To explore whether pressure and temperature can affect thermal contact resistance, we have proposed a new experimental approach for measurement of the thermal contact resistance. Taking the thermal contact resistance between phenolic resin and carbon-carbon composites, cuprum, and aluminum as the examples, the influence of the thermal contact resistance between specimens under pressure is tested by experiment. Two groups of experiments are performed and then an analysis on influencing factors of the thermal contact resistance is presented in this paper. The experimental results reveal that the thermal contact resistance depends not only on the thermal conductivity coefficient of materials, but on the interfacial temperature and pressure. Furthermore, the thermal contact resistance between cuprum and aluminum is more sensitive to pressure and temperature than that between phenolic resin and carbon-carbon composites.


2013 ◽  
Author(s):  
Bakri Abdulhay ◽  
Brahim Bourouga ◽  
Florent Alzetto ◽  
Ali Al Shaer ◽  
Ahmed Elmarakbi

2013 ◽  
Vol 61 (2) ◽  
pp. 141-148 ◽  
Author(s):  
Alexandre Blaise ◽  
Brahim Bourouga ◽  
Bakri Abdulhay ◽  
Christine Dessain

2020 ◽  
Vol 27 (7) ◽  
pp. 617-627
Author(s):  
Yuanyuan Tian ◽  
Mengjun Zhang ◽  
Junli Wang ◽  
Anbang Liu ◽  
Huaqing Xie ◽  
...  

Small ◽  
2021 ◽  
pp. 2102128
Author(s):  
Taehun Kim ◽  
Seongkyun Kim ◽  
Eungchul Kim ◽  
Taesung Kim ◽  
Jungwan Cho ◽  
...  

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