Effect of magnesium addition on inclusions in H13 die steel

2014 ◽  
Vol 21 (11) ◽  
pp. 1062-1067 ◽  
Author(s):  
Zheng Wu ◽  
Jing Li ◽  
Cheng-bin Shi ◽  
Liang-liang Wang
Author(s):  
S Kumar ◽  
R Singh ◽  
T P Singh ◽  
B L Sethi

The electrical discharge machining (EDM) process is extensively used in the tool and die making industry for accurate machining of internal profiles in hardened materials. Although it is essentially a material removal process, efforts have been made in the recent past to use it as surface treatment method. This article investigates and compares the effect of material transfer from electrode bodies (copper, copper—chromium, and copper—tungsten) and tungsten powder suspended in the dielectric medium during die-sinking EDM of AISI H13 die steel. Results show a 76 per cent increase in micro-hardness by machining with a copper—tungsten electrode and a 111 per cent increase by machining with tungsten powder mixed in the dielectric. The copper—chromium electrode gives the best surface roughness (Ra) value of 2.67 μ m. Scanning electron microscopy and X-ray diffraction analysis of the machined surfaces show alloying of parent material with tungsten and tungsten carbide. Chemical composition of the machined surfaces was further checked on an optical emission spectrometer to verify the results. Besides a significant presence of tungsten, an increase in the percentage of carbon is also observed.


2013 ◽  
Vol 690-693 ◽  
pp. 193-196
Author(s):  
Xiao Liu ◽  
Jing Long Liang

The effect of RE on modifying inclusions of H13 die steel was studied by metallographic examination, SEM and electron spectroscopy. Thermodynamic calculation was used to analyze the formation of RE inclusions in H13 die steel. The result shows that sulfide inclusions are modified to round RE complex inclusions after adding RE to H13 die steel.


Applied laser ◽  
2015 ◽  
Vol 35 (3) ◽  
pp. 314-318
Author(s):  
林继兴 Lin Jixing ◽  
曹洪钢 Cao Honggang ◽  
牛丽媛 Niu Liyuan ◽  
童先 Tong Xian ◽  
李光玉 Li Guangyu ◽  
...  

2007 ◽  
Vol 28 (1) ◽  
pp. 272-277 ◽  
Author(s):  
Hong Yan ◽  
J. Hua ◽  
R. Shivpuri

Sign in / Sign up

Export Citation Format

Share Document