Failure analysis and design modification of a briquetting machine roller

1995 ◽  
Vol 2 (4) ◽  
pp. 287-295
Author(s):  
Soon-Bok Lee
Author(s):  
Zhusan Luo ◽  
Mike Stanko ◽  
Carl Schwarz ◽  
Zhihong Annie Wang

Vibrational resonances of centrifugal compressor and radial inflow turbine impellers are usually identified using either Kushner’s or Singh’s parametric equations in product design and failure analysis. These equations were developed based on positive work accumulated within a certain time period. However, some resonances observed in simulation and testing cannot be understood with those resonance equations. This paper presents an alternative method to derive vibrational resonance conditions. A new model of general pressure pulsations is developed by taking into account the disturbances resulting from stationary obstacles and rotating blades. Analytical solutions of the forced vibration responses of a rotating disk subjected to different pressure pulsations are then formulated. From the forced responses, both Kushner’s and Singh’s equations can be derived. They can further prove to be equivalent though they focus on different physics. A general resonance condition is derived from the analytical solutions. This condition is a necessary condition, i.e. all resonances must meet this condition while a system following the condition may or may not be in resonance, depending upon excitation sources. It is noticed that the excitation sources could be related to harmonics due to stationary obstacles, harmonics with combined harmonic orders, or even harmonics to be understood. This general resonance condition can hence provide more “possible resonance points” and assist identifying resonances from more representative modes and more excitation sources. It has been validated by predicting vibrational resonances observed in three centrifugal compressors. This condition has also been successfully employed in the failure analysis and design modification of a radial inflow turbine impeller.


2009 ◽  
Vol 15 (S2) ◽  
pp. 784-785 ◽  
Author(s):  
F Schmidt

Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009


Author(s):  
Ramesh Varma ◽  
Jeffrey Bartolovitch ◽  
Victor Brzozowski ◽  
Carl Sokolowski

Abstract This paper reports using Scanning Acoustic Microscopy for solder joint failure analysis and process and design improvements. There are reliability concerns associated with solder voids or non-wetting of the solder to the bond pads which is particularly important for higher electrical power or temperature applications. Defects in solder can also occur and grow during operation and thermal cycling. Sonoscan is an attractive non-destructive test to characterize solder joints and is often used to study the growth of defects during life test simulations. X-ray imaging cannot identify very small defects, particularly non-wetting and delamination because of poor resolution. The instrument used in this study was a CSAM (C-Mode Scanning Acoustic Microscopy) operating in reflection mode at 30-100 MHz. We have identified voids inherent in the solder layer as well as delamination at the package to solder and solder to heat-sink interfaces. C-SAM results confirmed that the delamination was caused by CTE mismatch of the materials as well as the mechanical stresses caused by higher level package integration and module assemblies. Thermal cycling studies have shown that typically the voids do not grow whereas delamination does. These results were used to improve thermal heat-sinking and product reliability by minimizing defects in solder joint by changes in process and mechanical designs.


2017 ◽  
Vol 101 (5) ◽  
pp. 2084-2095 ◽  
Author(s):  
Lirong Luo ◽  
Xiao Shan ◽  
Yi Guo ◽  
Chunshan Zhao ◽  
Xin Wang ◽  
...  

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