scholarly journals Failure Analysis and Design of Cu-Be Alloy Clips

2009 ◽  
Vol 15 (S2) ◽  
pp. 784-785 ◽  
Author(s):  
F Schmidt
Keyword(s):  
Failure Analysis ◽  
Analysis And Design

Extended abstract of a paper presented at Microscopy and Microanalysis 2009 in Richmond, Virginia, USA, July 26 – July 30, 2009

Scanning Acoustic Microscopy for Solder Joint Failure Analysis and Design Improvements

2008 ◽  
Author(s):  
Ramesh Varma ◽  
Jeffrey Bartolovitch ◽  
Victor Brzozowski ◽  
Carl Sokolowski
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Thermal Cycling ◽  
Electrical Power ◽  
Acoustic Microscopy ◽  
Scanning Acoustic Microscopy ◽  
Joint Failure ◽  
Analysis And Design ◽  
Cte Mismatch ◽  
Bond Pads

Abstract This paper reports using Scanning Acoustic Microscopy for solder joint failure analysis and process and design improvements. There are reliability concerns associated with solder voids or non-wetting of the solder to the bond pads which is particularly important for higher electrical power or temperature applications. Defects in solder can also occur and grow during operation and thermal cycling. Sonoscan is an attractive non-destructive test to characterize solder joints and is often used to study the growth of defects during life test simulations. X-ray imaging cannot identify very small defects, particularly non-wetting and delamination because of poor resolution. The instrument used in this study was a CSAM (C-Mode Scanning Acoustic Microscopy) operating in reflection mode at 30-100 MHz. We have identified voids inherent in the solder layer as well as delamination at the package to solder and solder to heat-sink interfaces. C-SAM results confirmed that the delamination was caused by CTE mismatch of the materials as well as the mechanical stresses caused by higher level package integration and module assemblies. Thermal cycling studies have shown that typically the voids do not grow whereas delamination does. These results were used to improve thermal heat-sinking and product reliability by minimizing defects in solder joint by changes in process and mechanical designs.

scholarly journals Thermal barrier coatings with interface modified by 3D mesh patterns: Failure analysis and design optimization

2017 ◽  
Vol 101 (5) ◽  
pp. 2084-2095 ◽  
Author(s):  
Lirong Luo ◽  
Xiao Shan ◽  
Yi Guo ◽  
Chunshan Zhao ◽  
Xin Wang ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Design Optimization ◽  
Thermal Barrier Coatings ◽  
Thermal Barrier ◽  
Barrier Coatings ◽  
3D Mesh ◽  
Analysis And Design

Failure analysis and design of grouted fibre-composite repair system for corroded steel pipes

2021 ◽  
Vol 119 ◽  
pp. 104979
Author(s):  
Md Shamsuddoha ◽  
Allan Manalo ◽  
Thiru Aravinthan ◽  
Md Mainul Islam ◽  
Luke Djukic
Keyword(s):  
Failure Analysis ◽  
Fibre Composite ◽  
Repair System ◽  
Composite Repair ◽  
Steel Pipes ◽  
Analysis And Design

scholarly journals Engineering failure analysis and design optimisation with HiP-HOPS

2011 ◽  
Vol 18 (2) ◽  
pp. 590-608 ◽  
Author(s):  
Yiannis Papadopoulos ◽  
Martin Walker ◽  
David Parker ◽  
Erich Rüde ◽  
Rainer Hamann ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Design Optimisation ◽  
Analysis And Design
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