Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading

2008 ◽  
Vol 56 (2) ◽  
pp. 242-249 ◽  
Author(s):  
J.W. Ronnie Teo ◽  
Y.F. Sun
Keyword(s):  
Intermetallic Compounds ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Free Solder ◽  
Interfacial Intermetallic Compounds ◽  
Cycling Loading

Failure Analysis of Lead-Free Solder Joints of an 1657CCGA (Ceramic Column Grid Array) Package

2007 ◽  
Vol 4 (3) ◽  
pp. 112-120 ◽  
Author(s):  
John Lau ◽  
Todd Castello ◽  
Dongkai Shangguan ◽  
Walter Dauksher ◽  
Joe Smetana ◽  
...  
Keyword(s):  
Failure Analysis ◽  
Surface Finish ◽  
Failure Modes ◽  
Solder Joints ◽  
Temperature Cycling ◽  
Lead Free ◽  
Lead Free Solder ◽  
Organic Solderability Preservative ◽  
Solder Pastes ◽  
Free Solder

In this study, failure analysis of the 1657CCGA package with 95.5wt%Sn3.9wt%Ag0.6wt%Cu and 63wt%Sn37wt%Pb solder pastes on lead-free PCBs with the Entek OSP (organic solderability preservative) surface finish is investigated. Emphasis is placed on determining the failure locations and failure modes of the solder joints of the 1657CCGA assemblies after they have been through 7,000 cycles of temperature cycling.

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