Effect of intermetallic compounds on fracture behaviors of Sn3.0Ag0.5Cu lead-free solder joints during in situ tensile test

2011 ◽  
Vol 23 (1) ◽  
pp. 136-147 ◽  
Author(s):  
Yanhong Tian ◽  
Wei Liu ◽  
Rong An ◽  
Wei Zhang ◽  
Lina Niu ◽  
...  
Keyword(s):  
Tensile Test ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Lead Free ◽  
Lead Free Solder ◽  
Fracture Behaviors ◽  
Free Solder

Formation and Mechanical Properties of Intermetallic Compounds in Sn-Cu High-Temperature Lead-Free Solder Joints

2010 ◽  
Vol 654-656 ◽  
pp. 2450-2454 ◽  
Author(s):  
De Kui Mu ◽  
Hideaki Tsukamoto ◽  
Han Huang ◽  
Kazuhiro Nogita
Keyword(s):  
Mechanical Properties ◽  
High Temperature ◽  
Intermetallic Compounds ◽  
Solder Joints ◽  
Nickel Content ◽  
Lead Free ◽  
Lead Free Solder ◽  
Nickel Addition ◽  
Free Solder ◽  
Lead Free Solders

High-temperature lead-free solders are important materials for electrical and electronic devices due to increasing legislative requirements that aim at reducing the use of traditional lead-based solders. For the successful use of lead-free solders, a comprehensive understanding of the formation and mechanical properties of Intermetallic Compounds (IMCs) that form in the vicinity of the solder-substrate interface is essential. In this work, the effect of nickel addition on the formation and mechanical properties of Cu6Sn5 IMCs in Sn-Cu high-temperature lead-free solder joints was investigated using Scanning Electron Microscopy (SEM) and nanoindentation. It was found that the nickel addition increased the elastic modulus and hardness of the (Cu, Ni)6Sn5. The relationship between the nickel content and the mechanical properties of the IMCs was also established.

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