Effect of thermomigration on evolution of interfacial intermetallic compounds in Cu/Sn/Cu and Cu/Sn0.7Cu/Cu solder joints

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-015-2984-5 ◽

2015 ◽

Vol 26 (6) ◽

pp. 4313-4317 ◽

Author(s):

G. Q. Wei ◽

L. C. Du ◽

Y. P. Jia ◽

L. Qi

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Interfacial Intermetallic Compounds

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Time dependent deformation behavior of interfacial intermetallic compounds in electronic solder joints

2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference ◽

10.1109/impact.2009.5382227 ◽

2009 ◽

Author(s):

Jenn-Ming Song ◽

Chien-Wei Su ◽

Yi-Shao Lai ◽

Ying-Ta Chiu

Keyword(s):

Intermetallic Compounds ◽

Deformation Behavior ◽

Solder Joints ◽

Time Dependent ◽

Interfacial Intermetallic Compounds

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Effect of electromigration and aging on evolution of interfacial intermetallic compounds in Cu-Solder-Cu solder joints

2017 18th International Conference on Electronic Packaging Technology (ICEPT) ◽

10.1109/icept.2017.8046455 ◽

2017 ◽

Author(s):

Wenya Tian ◽

Junhui Li

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Interfacial Intermetallic Compounds

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Growth mechanisms of interfacial intermetallic compounds in Sn/Cu–Zn solder joints during aging

Journal of Materials Science ◽

10.1007/s10853-012-6581-1 ◽

2012 ◽

Vol 47 (17) ◽

pp. 6467-6474 ◽

Author(s):

Chi-Yang Yu ◽

Jenq-Gong Duh

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Growth Mechanisms ◽

Interfacial Intermetallic Compounds

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Diffusion wave model and growth kinetics of interfacial intermetallic compounds in Sn–3.0Ag–0.5Cu–xTiO2 solder joints

Journal of Materials Science Materials in Electronics ◽

10.1007/s10854-015-2817-6 ◽

2015 ◽

Vol 26 (5) ◽

pp. 3196-3205 ◽

Author(s):

Y. Tang ◽

G. Y. Li ◽

S. M. Luo ◽

K. Q. Wang ◽

B. Zhou

Keyword(s):

Intermetallic Compounds ◽

Growth Kinetics ◽

Solder Joints ◽

Diffusion Wave ◽

Interfacial Intermetallic Compounds ◽

Kinetics Of ◽

Diffusion Wave Model

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Effect of type of thermo-mechanical excursion on growth of interfacial intermetallic compounds in Cu/Sn-Ag-Cu solder joints

Microelectronics Reliability ◽

10.1016/j.microrel.2017.05.011 ◽

2017 ◽

Vol 74 ◽

pp. 44-51 ◽

Author(s):

Rituparna Ghosh ◽

Anwesha Kanjilal ◽

Praveen Kumar

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Interfacial Intermetallic Compounds

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A diffusion model and growth kinetics of interfacial intermetallic compounds in Sn-0.3Ag-0.7Cu and Sn-0.3Ag-0.7Cu-0.5CeO2 solder joints

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2019.152893 ◽

2020 ◽

Vol 818 ◽

pp. 152893 ◽

Author(s):

Z.H. Li ◽

Y. Tang ◽

Q.W. Guo ◽

G.Y. Li

Keyword(s):

Intermetallic Compounds ◽

Diffusion Model ◽

Growth Kinetics ◽

Solder Joints ◽

Interfacial Intermetallic Compounds ◽

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Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates

MATERIALS TRANSACTIONS ◽

10.2320/matertrans.m2009016 ◽

2009 ◽

Vol 50 (5) ◽

pp. 1231-1234 ◽

Author(s):

Jenn-Ming Song ◽

Yu-Lin Shen ◽

Chien-Wei Su ◽

Yi-Shao Lai ◽

Ying-Ta Chiu

Keyword(s):

Strain Rate ◽

Intermetallic Compounds ◽

Solder Joints ◽

Rate Dependence ◽

Strain Rate Dependence ◽

Interfacial Intermetallic Compounds

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Spalling behavior of interfacial intermetallic compounds in Pb-free solder joints subjected to temperature cycling loading

Acta Materialia ◽

10.1016/j.actamat.2007.09.026 ◽

2008 ◽

Vol 56 (2) ◽

pp. 242-249 ◽

Author(s):

J.W. Ronnie Teo ◽

Y.F. Sun

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Temperature Cycling ◽

Free Solder ◽

Interfacial Intermetallic Compounds ◽

Cycling Loading

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Brittle fracture induced by phase transformation of Ni-Cu-Sn intermetallic compounds in Sn-3Ag-0.5Cu/Ni solder joints under extreme temperature environment

Journal of Alloys and Compounds ◽

10.1016/j.jallcom.2018.10.394 ◽

2019 ◽

Vol 777 ◽

pp. 463-471 ◽

Author(s):

Ruyu Tian ◽

Chunjin Hang ◽

Yanhong Tian ◽

Jiayun Feng

Keyword(s):

Phase Transformation ◽

Brittle Fracture ◽

Intermetallic Compounds ◽

Solder Joints ◽

Extreme Temperature ◽

Temperature Environment

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Nanomechanical Characterization of Intermetallic Compounds in Lead Free Solder Joints

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00355 ◽

2018 ◽

Author(s):

Abdullah Fahim ◽

Sudan Ahmed ◽

Jeffrey C. Suhling ◽

Pradeep Lall

Keyword(s):

Intermetallic Compounds ◽

Solder Joints ◽

Lead Free ◽

Lead Free Solder ◽

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