2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
Latest Publications

TOTAL DOCUMENTS

373

(FIVE YEARS 0)

H-INDEX

12

(FIVE YEARS 0)

Published By IEEE

9781538649992

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Performance of Fine and Ultra-Fine Lead-Free Powders for Solder Paste Applications

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00291 ◽

2018 ◽

Author(s):

Amir H. Nobari ◽

Sylvain St-Laurent ◽

Yannig Thomas ◽

Arslane Bouchemit ◽

Gilles L'Esperance

Keyword(s):

Lead Free ◽

Download Full-text

Integration of Chip-Scale SERF Atomic Magnetometers for Magnetoencephalography Measurement

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00124 ◽

2018 ◽

Author(s):

Guoliang Li ◽

Jintang Shang ◽

Yu Ji ◽

Lin Lu ◽

Zhihua Pan

Download Full-text

Warpage Measurements and Characterizations of Fan-Out Wafer-Level Packaging with Large Chips and Multiple Redistributed Layers

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00094 ◽

2018 ◽

Author(s):

John Lau ◽

Wu Kai ◽

Nelson Fan ◽

Eric Kuah ◽

Zhang Li ◽

...

Keyword(s):

Wafer Level ◽

Wafer Level Packaging

Download Full-text

Study on an Improved Wafer Level Fabrication Process to Achieve Size Uniformity for Micro Glass Shell Resonators

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00147 ◽

2018 ◽

Author(s):

Zhaoxi Su ◽

Jintang Shang ◽

Bin Luo ◽

Ching-Ping Wong

Keyword(s):

Fabrication Process ◽

Wafer Level ◽

Glass Shell ◽

Size Uniformity

Download Full-text

Program Committee

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00007 ◽

2018 ◽

Keyword(s):

Program Committee

Download Full-text

A Volatile Molecular Sensor Using Terahertz Resonators on Porous Substrates

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00345 ◽

2018 ◽

Author(s):

Saranraj Karuppuswami ◽

Jennifer A. Byford ◽

Premjeet Chahal

Keyword(s):

Molecular Sensor ◽

Porous Substrates

Download Full-text

Heterogeneous Integration Challenges Within Wafer Level Fan-Out SiP for Wearables and IoT

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00226 ◽

2018 ◽

Author(s):

Alberto Martins ◽

Marcio Pinheiro ◽

Ana Filipa Ferreira ◽

Rodrigo Almeida ◽

Filipe Matos ◽

...

Keyword(s):

Heterogeneous Integration ◽

Download Full-text

A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00026 ◽

2018 ◽

Author(s):

B. Goubault ◽

G. Aspar ◽

J.-C. Souriau ◽

L. Castagne ◽

G. Simon ◽

...

Keyword(s):

3D Printing ◽

Encapsulation Process ◽

Microsystem Packaging

Download Full-text

A New, Efficient Method for Preparation of 3D Integrated Systems by Laser Techniques

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00342 ◽

2018 ◽

Author(s):

Robert Klengel ◽

Sandy Klengel ◽

Georg Schusser ◽

Michael Krause

Keyword(s):

Efficient Method ◽

Integrated Systems ◽

Laser Techniques

Download Full-text

Analog Power Filtering: Modeling, Measuring & Analog PI

2018 IEEE 68th Electronic Components and Technology Conference (ECTC) ◽

10.1109/ectc.2018.00253 ◽

2018 ◽

Author(s):

Layne Berge ◽

Matt Doyle ◽

Kyle Schoneck

Download Full-text