2018 IEEE 68th Electronic Components and Technology Conference (ECTC)
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373
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12
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9781538649992
Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Fork Type Structure of Silicon Waveguide for Optical Efficiency Optimization

2018 ◽  
Author(s):  
Warren Wang ◽  
Onion Z.Y. Yang ◽  
Shian Tu ◽  
Meiju Lu ◽  
Jihan Chen ◽  
...  
Keyword(s):  
Type Structure ◽  
Optical Efficiency ◽  
Efficiency Optimization ◽  
Silicon Waveguide

Low Temperature Solder Attach of SnAgCu Bumped Components for a Flexible Hybrid Electronics Based Medical Monitor

2018 ◽  
Author(s):  
Thaer M. Alghoul ◽  
Manu Yadav ◽  
Sanoop Thekkut ◽  
Rajesh S. Sivasubramony ◽  
Christopher M. Greene ◽  
...  
Keyword(s):  
Low Temperature

Interconnection Process Using Laser and Hybrid Underfill for LED Array Module on PET Substrate

2018 ◽  
Author(s):  
Kwang-Seong Choi ◽  
Wagno Alves Braganca Junior ◽  
leeseul Jeong ◽  
Keon-Soo Jang ◽  
Seok Hwan Moon ◽  
...  
Keyword(s):  
Led Array ◽  
Pet Substrate

Development of WLCSP for Accelerometer Packaging with Vertical CuPd Wire as Through Mold Interconnection (TMI)

2018 ◽  
Author(s):  
Zhaohui Chen ◽  
Boon Long Lau ◽  
Zhipeng Ding ◽  
Eva Leong Ching Wai ◽  
Beibei Han ◽  
...  

A New Microsystem Packaging Approach Using 3D Printing Encapsulation Process

2018 ◽  
Author(s):  
B. Goubault ◽  
G. Aspar ◽  
J.-C. Souriau ◽  
L. Castagne ◽  
G. Simon ◽  
...  
Keyword(s):  
3D Printing ◽  
Encapsulation Process ◽  
Microsystem Packaging
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