Experimental characterization of spatial variability for random field modeling on struts of additively manufactured lattice structures

2020 ◽  
Vol 36 ◽  
pp. 101471
Author(s):  
O.Utku Gungor ◽  
Recep M. Gorguluarslan
Author(s):  
Recep M. Gorguluarslan ◽  
O. Utku Gungor

Abstract In this study, the influence of the spatial variability of geometric uncertainties on the strut members of the lattice structures fabricated by additive manufacturing is investigated. Individual struts are fabricated with various printing angles and diameters using a material extrusion process and PLA material. The diameter values of the fabricated samples are measured along the printing and radial directions at each layer under an optical microscope. Spatial correlations are characterized based on the measurements using the experimental autocorrelation function. Candidate autocorrelation functions are fitted to the measured data to identify the best fitted one for each diameter parameter and the corresponding correlation lengths are evaluated for random field. The applicability of the Karhunen-Loeve expansion (KLE) is investigated to reduce the dimensionality of the random field discretization. The results show that the diameters of the strut members at each layer are spatially dependent and the KLE method was found to give a good representation of the random field.


2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.


1982 ◽  
Vol 10 (1) ◽  
pp. 37-54 ◽  
Author(s):  
M. Kumar ◽  
C. W. Bert

Abstract Unidirectional cord-rubber specimens in the form of tensile coupons and sandwich beams were used. Using specimens with the cords oriented at 0°, 45°, and 90° to the loading direction and appropriate data reduction, we were able to obtain complete characterization for the in-plane stress-strain response of single-ply, unidirectional cord-rubber composites. All strains were measured by means of liquid mercury strain gages, for which the nonlinear strain response characteristic was obtained by calibration. Stress-strain data were obtained for the cases of both cord tension and cord compression. Materials investigated were aramid-rubber, polyester-rubber, and steel-rubber.


AIAA Journal ◽  
2002 ◽  
Vol 40 ◽  
pp. 16-25
Author(s):  
J. P. Wojno ◽  
T. J. Mueller ◽  
W. K. Blake

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