scholarly journals Experimental study on enhanced heat transfer during rapid cooling of modified and oxidized rods

2021 ◽  
pp. 108806
Author(s):  
Shikha A. Ebrahim ◽  
Ammar M. Bahman ◽  
Khaled Almutairi ◽  
Mohammad A. Alalaimi
2019 ◽  
Vol 92 (3) ◽  
pp. 285-301 ◽  
Author(s):  
Wei Li ◽  
Yan Dong ◽  
Jun Wang ◽  
Yong Zhang ◽  
Xu Zhang ◽  
...  

Author(s):  
Dongsheng Zhu ◽  
Yuanxi Li ◽  
Jingwei Zhang ◽  
Xiang Jiang

This paper presents a simulation of two operations—upwind, downwind with two-phase flowing in the plate bundles of the plate-type evaporative condenser, by means of the FLUENT software, which provide a direct illustration of the influence of the water film flowing on spray water flow, air velocity, air direction in the plate bundles. The result of simulation demonstrates the advantages of air-water parallel-flow over countercurrent in making use of enhanced heat transfer and mass transfer of fluid film.


2015 ◽  
Vol 137 (7) ◽  
Author(s):  
Maritza Ruiz ◽  
Van P. Carey

This paper presents an experimental study of the heat transfer and pressure drop characteristics of a single phase high heat flux microchannel cooling system with spiraling radial inflow. The heat sink provides enhanced heat transfer with a simple inlet and outlet design while providing uniform flow distribution. The system is heated from one conducting wall made of copper and uses water as a working fluid. The microchannel has a 1 cm radius and a 300 μm gap height. Experimental results show, on average, a 76% larger pressure drop compared to an analytic model for laminar flow in a parallel disk system with spiral radial inflow. The mean heat transfer coefficients measured are up to four times the heat transfer coefficient for unidirectional laminar fully developed flow between parallel plates with the same gap height. Flow visualization studies indicate the presence of secondary flows and the onset of turbulence at higher flow rates. Combined with the thermally developing nature of the flow, these characteristics lead to enhanced heat transfer coefficients relative to the laminar parallel plate values. Another beneficial feature of this device, for high heat flux cooling applications, is that the thermal gradients on the surface are small. The average variation in surface temperature is 18% of the total bulk fluid temperature gain across the device. The system showed promising cooling characteristics for electronics and concentrated photovoltaics applications with a heat flux of 113 W/cm2 at a surface temperature of 77 °C and a ratio of pumping power to heat rate of 0.03%.


2011 ◽  
Vol 48 (6) ◽  
pp. 965-978 ◽  
Author(s):  
Stella Jesumathy ◽  
M. Udayakumar ◽  
S. Suresh

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