Peridynamic modeling of elastic bimaterial interface fracture

2022 ◽  
Vol 390 ◽  
pp. 114458
Author(s):  
Heng Zhang ◽  
Xiong Zhang ◽  
Yan Liu ◽  
Pizhong Qiao
Author(s):  
D. A. O’Neil ◽  
J. H. Selverian ◽  
K. S. Kim

A new probabilistic failure criterion was developed for the design of high-temperature ceramic-to-metal joints. The essential feature of the theory is the inclusion of the energy dissipated during plastic deformation of the adjacent braze layer in the joint. A large number of bi-material interface fracture simulations were performed for different crack positions and orientations near the bimaterial interface to determine the effect on stresses in the ceramic near the interface. The effective stress values were then ported to a probabilistic failure analysis code, which permitted simple inclusion of the new failure criterion. Brazed joints were made and failure tested in torsion to verify the failure criterion. Results show that the new failure criterion more closely approximates the failure of the ceramic-to-metal joints over the entire range of ultimate loads, an is a significant improvement in the failures criteria previously used for this type of joint design. Aspects of the failure criterion, material systems, residual stresses, mechanical behavior, and strength predictions will be presented.


2008 ◽  
Vol 130 (1) ◽  
Author(s):  
John Jy-An Wang ◽  
Ian G. Wright ◽  
Michael J. Lance ◽  
Ken C. Liu

A material configuration of central importance in composite materials or in protective coating technology is a thin film of one material deposited onto a substrate of a different material. Fabrication of such a structure inevitably gives rise to stress in the film due to lattice mismatch, differing coefficient of thermal expansion, chemical reactions, or other physical effects. Therefore, in general, the weakest link in this composite system often resides at the interface between the thin film and the substrate. In order to make multilayered electronic devices and structural composites with long-term reliability, the fracture behavior of the material interfaces must be known. This project offers an innovative testing procedure of using a spiral notch torsion bar method for the determination of interface fracture toughness that is applicable to thin coating materials in general. The feasibility study indicated that this approach for studying thin film interface fracture is repeatable and reliable, and the demonstrated test method closely adheres to and is consistent with classical fracture mechanics theory.


2008 ◽  
Vol 22 (31n32) ◽  
pp. 6141-6148 ◽  
Author(s):  
SHUICHENG YANG ◽  
LI SONG ◽  
ZHE LI ◽  
SONGMEI HUANG

Fracture toughness is a critical input parameter for fracture-mechanics based fitness-for-service assessments, and it is preferable to determine this by experiment. In the present paper, fracture toughness of rock/concrete bimaterial interface was obtained by the tests which were performed on the universal material tester. A beam specimen with single-edge crack is used to form the different fracture mode mixity. The stress intensity factors of specimen per unit load with different combinations of K1 and K2 were calculated by the mixed hybrid finite element method on the principals of linear elastic interface fracture mechanics. By regressing the critical stress intensity factors of 7 specimen groups, two experiential fracture criterions of mixed crack interface were derived, and the fracture toughness([Formula: see text], [Formula: see text]) of rock/concrete were obtained further.


1996 ◽  
Vol 118 (1) ◽  
pp. 159-166
Author(s):  
D. A. ONeil ◽  
J. H. Selverian ◽  
K. S. Kim

A new probabilistic failure criterion was developed for the design of high-temperature ceramic-to-metal joints. The essential feature of the theory is the inclusion of the energy dissipated during plastic deformation of the adjacent braze layer in the joint. A large number of bimaterial interface fracture simulations were performed for different crack positions and orientations near the bimaterial interface to determine the effect on stresses in the ceramic near the interface. The effective stress values were then ported to a probabilistic failure analysis code, which permitted simple inclusion of the new failure criterion. Brazed joints were made and failure tested in torsion to verify the failure criterion. Results show that the new failure critertion more closely approximates the failure of the ceramic-to-metal joints over the entire range of ultimate loads, and is a significant improvement in the failures criteria previously used for this type of joint design. Aspects of the failure criterion, material systems, residual stresses, mechanical behavior, and strength predictions will be presented.


1991 ◽  
Vol 238 ◽  
Author(s):  
Clifford P. Warner ◽  
Dawn A. Bonnell

ABSTRACTThe Scanning Tunneling Microscope was used as a surface profilometer to image fractured interfaces of a model metal/ceramic system, Au/sapphire. By characterizing the metal side of interface fracture, features related to plastic deformation were quantified. The spatial resolution of STM allowed these measurements to be made down to the nanometer scale. Mathematical techniques were developed to characterize surface features on several size scales and to relate them to the mechanisms from which they were produced.


1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.


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