Multi-phase-field modelling of electromigration-induced void migration in interconnect lines having bamboo structures
2014 ◽
Vol 2014.27
(0)
◽
pp. 573-574
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2010 ◽
Vol 46
(7)
◽
pp. 781-786
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2018 ◽
Vol 13
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pp. 781-786
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2021 ◽
Vol 378
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pp. 113729
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