Multi-phase-field modelling of electromigration-induced void migration in interconnect lines having bamboo structures

2020 ◽  
Vol 184 ◽  
pp. 109848
Author(s):  
Akimitsu Ishii ◽  
Akinori Yamanaka
2019 ◽  
Vol 21 (4) ◽  
pp. 495-547
Author(s):  
Oliver Dunbar ◽  
Kei Fong Lam ◽  
Björn Stinner

2021 ◽  
Vol 94 ◽  
pp. 68-86
Author(s):  
Duc Hong Doan ◽  
Thom Van Do ◽  
Nguyen Xuan Nguyen ◽  
Pham Van Vinh ◽  
Nguyen Thoi Trung

Author(s):  
Peter Bollada ◽  
Peter K Jimack ◽  
Andrew M Mullis

We summarise contributions made to the computational phase-field modelling of alloy solidification from the University of Leeds spoke of the LiME project. We begin with a general introduction to phase-field, and then reference the numerical issues that arise from solution of the model, before detailing each contribution to the modelling itself. These latter contributions range from controlling and developing interface-width independent modelling; controlling morphology in both single and multiphase settings; generalising from single to multi-phase models; and creating a thermodynamic consistent framework for modelling entropy flow and thereby postulate a temperature field consistent with the concepts of, and applicable in, multiphase and density-dependent settings.


2018 ◽  
Vol 13 ◽  
pp. 781-786 ◽  
Author(s):  
Zhengkun Liu ◽  
Julian Roggel ◽  
Daniel Juhre

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