Rapid formation of well-ordered self-assembled monolayers of dodecanethiol on polycrystalline gold by microwave irradiation

2008 ◽  
Vol 10 (4) ◽  
pp. 582-586 ◽  
Author(s):  
Jianyuan Dai ◽  
Jiongjia Cheng ◽  
Zhiguo Li ◽  
Yanqing Shi ◽  
Na An ◽  
...  
Langmuir ◽  
1998 ◽  
Vol 14 (22) ◽  
pp. 6419-6423 ◽  
Author(s):  
Mong-Tung Lee ◽  
Chen-Chan Hsueh ◽  
Michael S. Freund ◽  
Gregory S. Ferguson

1992 ◽  
Vol 114 (25) ◽  
pp. 9943-9952 ◽  
Author(s):  
Yaw S. Obeng ◽  
Mark E. Laing ◽  
Andrienne C. Friedli ◽  
Huey C. Yang ◽  
Dongni Wang ◽  
...  

2004 ◽  
Vol 847 ◽  
Author(s):  
Yoshitaka Fujita ◽  
Norifumi Nakamoto ◽  
Hiroyuki Takeda ◽  
Tomoya Hidaka ◽  
Nobuo Kimura ◽  
...  

ABSTRACTWe have discovered a novel chemisorption method using octadecyltrimethoxysilane (ODMS), titanium tetraisopropoxide (TTIP), water, and toluene [1] to form highly-ordered self-assembled monolayers (SAM) of ODMS. The SAMs were formed rapidly from the active solution even when it was kept for three months. The solution and layers were characterized by several methods. We propose a mechanism for the rapid formation of the ODMS-SAM.


2012 ◽  
Vol 3 ◽  
pp. 101-113 ◽  
Author(s):  
Zhe She ◽  
Andrea DiFalco ◽  
Georg Hähner ◽  
Manfred Buck

Self-assembled monolayers (SAMs) of 4'-methylbiphenyl-4-thiol (MBP0) adsorbed on polycrystalline gold substrates served as templates to control electrochemical deposition of Cu structures from acidic solution, and enabled the subsequent lift-off of the metal structures by attachment to epoxy glue. By exploiting the negative-resist behaviour of MBP0, the SAM was patterned by means of electron-beam lithography. For high deposition contrast a two-step procedure was employed involving a nucleation phase around −0.7 V versus Cu2+/Cu and a growth phase at around −0.35 V versus Cu2+/Cu. Structures with features down to 100 nm were deposited and transferred with high fidelity. By using substrates with different surface morphologies, AFM measurements revealed that the roughness of the substrate is a crucial factor but not the only one determining the roughness of the copper surface that is exposed after lift-off.


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