scholarly journals Finite element failure analysis of wires for civil engineering applications with various crack-like laminations

2016 ◽  
Vol 60 ◽  
pp. 229-249 ◽  
Author(s):  
K.K. Adewole ◽  
S.J. Bull
2014 ◽  
Vol 60 (4) ◽  
pp. 397-408
Author(s):  
K.K. Adewole ◽  
S.J. Bull

AbstractThis paper presents a numerical investigation of the effects of lamination orientation on the fracture behaviour of rectangular steel wires for civil engineering applications using finite element (FE) analysis. The presence of mid-thickness across-the-width lamination changes the cup and cone fracture shape exhibited by the lamination-free wire to a V-shaped fracture with an opening at the bottom/pointed end of the V-shape at the mid-thickness across-the-width lamination location. The presence of mid-width across-the-thickness lamination changes the cup and cone fracture shape of the lamination-free wire without an opening to a cup and cone fracture shape with an opening at the lamination location. The FE fracture behaviour prediction approach adopted in this work provides an understanding of the effects of lamination orientation on the fracture behaviour of wires for civil engineering applications which cannot be understood through experimental investigations because it is impossible to machine laminations in different orientations into wire specimens.


Author(s):  
Mark D. Nickerson ◽  
Chandrakant S. Desai

Thermomechanical, power temperature cycling (PTC) and vibration analyses were performed on a 313 staggered pin PBGA package using plastic and viscoplastic disturbed-state damage models. An accelerated finite element failure analysis was performed using a newly developed procedure. Validations were performed using published PBGA test data. The disturbed state concept was used to model the disturbance (damage) accumulated in PBGA solder joints subjected to thermal cycling (PTC and TCT), vibration, and vibration coupled with three distinct temperatures. 2D FEA plastic and viscoplastic models were created based on a diagonal “slice” of the PBGA. This allowed the most critical solder balls (under the die and furthest DNP) to be analyzed in the same model. The thermal cycling results indicate that the solder balls under the die are the most likely to fail. The vibration results indicate the solder balls furthest from the package center are most likely to fail. The vibration results, coupled with distinct isothermal temperatures, indicate that as temperature increases, the cycles to failure decreases.


1991 ◽  
Vol 41 (5) ◽  
pp. 1087-1093 ◽  
Author(s):  
S.M.R. Adluri ◽  
M.K.S. Madugula ◽  
G.R. Monforton

2002 ◽  
Vol 24 (2) ◽  
pp. 151-162 ◽  
Author(s):  
Ha-Won Song ◽  
Dong-Woo You ◽  
Keun-Joo Byun ◽  
Koichi Maekawa

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