scholarly journals Using transient plane source sensor for determination of thermal properties of vacuum insulation panels

2012 ◽  
Vol 1 (4) ◽  
pp. 334-340 ◽  
Author(s):  
Pär Johansson ◽  
Bijan Adl-Zarrabi ◽  
Carl-Eric Hagentoft
2014 ◽  
Vol 526 ◽  
pp. 46-51
Author(s):  
Li Xiong Zhang ◽  
Rong Gang Gao

Based on the traditional theory of transient plane source for thermal conductivity measurement, this paper designed and developed a new pattern of heating and temperature sensing probe, presented the study of transient heat conduction of half-infinite plane while being heated, established a modified mathematical model of transient plane source method, and achieved the measurement of thermal conductivity of automotive interior material sample by the data processing method of mathematical iteration and liner regression using the modified transient plane source probe. According to the data of experiments, the instrument which this paper designed has a high precision of 5% and a wide range of 0.003-1W/(mK).This paper provides a practicable way for heat capacity determination of automotive interior materials.


2021 ◽  
Vol 407 ◽  
pp. 185-191
Author(s):  
Josef Tomas ◽  
Andreas Öchsner ◽  
Markus Merkel

Experimental analyses are performed to determine thermal conductivity, thermal diffusivity and volumetric specific heat with transient plane source method on hollow sphere structures. Single-sided testing is used on different samples and different surfaces. Results dependency on the surface is observed.


2020 ◽  
Vol 51 (5) ◽  
pp. 1928-1932 ◽  
Author(s):  
Jesse F. White ◽  
Konstantinos Rigas ◽  
S. Peter Andersson ◽  
Björn Glaser

Abstract Thermal properties of green Söderberg electrode pastes were measured up to 1073 K (800 °C) using the transient plane source method. Comparison was made to measurements on an electrode material baked beforehand to 1473 K (1200 °C). For the green pastes, thermal conductivity was found to decrease up to 673 K (400 °C) at the onset of baking. After about 873 K (600 °C), thermal conductivity of the material increases with increasing temperature. For previously baked Söderberg material, thermal conductivity continually increases with increasing temperature.


Holzforschung ◽  
2013 ◽  
Vol 67 (4) ◽  
pp. 437-445 ◽  
Author(s):  
Anna Dupleix ◽  
Andrzej Kusiak ◽  
Mark Hughes ◽  
Fréderic Rossi

Abstract The thermal properties of wood in the green state have been determined by the transient plane source (TPS) technique. Data are presented on thermal conductivity (λ), heat capacity (C), and thermal diffusivity (κ) at moisture contents (MCs) above the fiber saturation point, which are based on measurements using the HotDisk® apparatus. Four wood species (Douglas fir, beech, birch, and spruce) were tested, and the results are compared with literature data and those obtained by the flash method. A linear relationship was found between the thermal properties λ, C, and κ on the one hand and MC on the other. Equations predicting the thermal values as a function of MC and wood anisotropy are presented. Wood C and λ increase with MC, but wet wood diffuses heat more rapidly than dry wood.


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