Thermal management of electronic components based on new wave bio-inspired structures and nanofluids

2022 ◽  
Vol 131 ◽  
pp. 105840
Author(s):  
Zhibo Tang ◽  
Cong Qi ◽  
Zhen Tian ◽  
Lanqi Chen
Keyword(s):  
Thermal Management ◽  
New Wave ◽  
Electronic Components

A Study on the Thermal Management of the Electronic Parts and Systems

2004 ◽  
Author(s):  
Jyh-Tong Teng ◽  
Shih-Cheng Tsang ◽  
Jiunn-Shyang Chen ◽  
Tien-Juinn Fung
Keyword(s):  
Thermal Management ◽  
Power Supply ◽  
High Energy ◽  
Electronic Components ◽  
Desktop Computer ◽  
Notebook Computer ◽  
Parametric Studies ◽  
Switch Power Supply ◽  
Switch Power ◽  
Electronic Parts

The rapid developments of computer industry and semiconductor processes lead to high component density, high-energy dissipation, and compact volume of the electronic components in systems. Those are especially true for the high-energy density of the CPUs, resulting in high temperature rise for the electronic chips. To preserve the life span of the integrated circuits and to ensure their proper functions, it is necessary to develop proper means for evaluating the related thermal management in order to effectively dissipate the energy released from these electronic parts and systems. This project used Icepak 4.0, developed by Fluent, to determine thermal-fluidic behaviors of the notebook computer, desktop computer, and switch power supply, under an environmental temperature of 35°C. In addition, parametric studies were carried out to evaluate the distribution of temperature inside the systems under investigation and the effectiveness of overall thermal management for the systems. Icepak uses the unstructured grid generation technique for the three-dimensional modeling of the electronic components and systems. With the computational fluid dynamics (CFD) solver employed by Fluent and using the finite volume method, Icepak simulates the flow and temperature fields inside the system or component of concern. Parametric studies — including the positions for venting, the locations for the cooling fans, the directions of flow for the fans (either by blowing or suction), and the number of fins used for heat dissipation — were carried out to determine the effectiveness of the thermal management designs of the desktop computer, notebook computer, and switch power supply under an environment temperature of 35 °C. Results of this study indicated that the peak component temperatures for the three systems under study are 84 °C, 80 °C, and 81 °C, respectively, while the maximum allowable temperatures suggested by the manufacturers of these three items are 85 °C, 90 °C, and 85 °C, respectively.

Pool Boiling of Mixtures for Electronics Thermal Management

2010 ◽  
Author(s):  
Aravind Sathyanarayana ◽  
Yogendra Joshi ◽  
Yunhyeok Im
Keyword(s):  
Heat Transfer ◽  
Thermal Management ◽  
Pool Boiling ◽  
Nanowire Arrays ◽  
Test Surface ◽  
Electronic Components ◽  
Fluid Mixtures ◽  
Heat Transfer Fluids ◽  
Transfer Properties ◽  
Latent Heat Of Vaporization

Electrical and chemical compatibility requirements of electronic components pose significant constraints on the choice of liquid coolants. These constraints have led to the use of fluoroinerts and Novec liquids as coolants, which are plagued by significantly lower thermal conductivity, specific heat, and latent heat of vaporization compared to water, and also a number of these chemicals have significant environmental impact. These factors necessitate the development of new heat transfer fluids with improved heat transfer properties and applicability. Mixture formulations provide an avenue for enhancing the properties of existing heat transfer fluids. These can be tuned for specific applications. Mixture formulations of Novec fluid (HFE 7200) with alcohols and ethers (HFE 7200 and methanol; HFE 7200 and ethoxybutane) are considered in this study. A 1 cm × 1 cm Silicon (Si) sample having copper nanowire arrays is used as the test surface for pool boiling. Experiments are done under saturated conditions and also at different sub-cooled conditions to investigate the thermal performance of these new fluid mixtures. Pool boiling heat transfer performance and the critical heat flux are measured for fluid mixtures and compared with the corresponding base fluid. From the pool boiling experiments, it was observed that adding methanol to pure HFE 7200 enhances the CHF of the resulting mixture and adding ethoxybutane to pure HFE 7200 reduces the incipience temperature for boiling.

Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

Numerical Evaluation on the Cooling Capability of MEMS Based Liquid Metal Cooling Device Used in Harsh Environment

2007 ◽  
Author(s):  
Zhong-Shan Deng ◽  
Jing Liu ◽  
Yi-Xin Zhou
Keyword(s):  
Thermal Management ◽  
Numerical Evaluation ◽  
High Capacity ◽  
Small Scale ◽  
Harsh Environment ◽  
Electronic Components ◽  
Cooling Device ◽  
Sensors And Actuators ◽  
Micro Systems ◽  
Liquid Metal Cooling

The thermal management of the increasing fast chips has been a major concern in packaging of micro/nano systems [1]. These chips are squeezing into tighter and tighter spaces with no enough places for heat to dissipate. It is expected that heat flux levels in excess of 100 W/cm2 for commercial electronics and over 1000 W/cm2 for selected military high power electronics will soon become a realistic challenge to overcome. Meanwhile, high-capacity cooling options remain limited for many small-scale applications such as micro-systems, sensors and actuators, and micro/nano electronic components.

Miniaturisation of Electronic Components and the Problem of Device Overheating

2021 ◽  
Vol 69 (2) ◽  
pp. 53-58
Author(s):  
Titu-Marius BĂJENESCU
Keyword(s):  
Thermal Management ◽  
New Technologies ◽  
Power Converters ◽  
External Heat ◽  
Heat Sinks ◽  
Data Generation ◽  
Single Chip ◽  
Electronic Components ◽  
Liquid Cooling ◽  
Energy Saving Potential

With the ever-increasing rate of data generation and communication, as well as the constant push to reduce the size and costs of industrial converter systems, the power density of electronics has risen. Consequently, cooling, with its enormous energy and water consumption, has an increasingly large environmental impact, and new technologies are needed to extract the heat in a more sustainable way-that is, requiring less water and energy. Embedding liquid cooling directly inside the chip is a promising approach for more efficient thermal management. However, the electronics and cooling are treated separately, leaving the full energy-saving potential of embedded cooling untapped. By removing the need for large external heat sinks, this approach should enable the realization of very compact power converters integrated on a single chip.

Numerical Study of Cyclic Melting and Solidification of Nano Enhanced Phase Change Material Based Heat Sink in Thermal Management of Electronic Components

2016 ◽  
Author(s):  
S. K. Sahoo ◽  
M. K. Das ◽  
P. Rath
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Management ◽  
Forced Convection ◽  
Heat Sink ◽  
Volume Concentration ◽  
Nano Particles ◽  
Nano Particle ◽  
Electronic Components ◽  
Change Material

The Present investigation has been carried out to study the performance of nano enhanced phase change material (NEPCM) based heat sink for thermal management of electronic components. Enthalpy based finite volume method is used for the analysis of phase change process in NEPCM. To enhance the thermal conductivity of phase change material (PCM), copper oxide nano particles of volume fractions 1%, 2.5% and 5% are added to PCM. A heat flux of 2500 W/m2 is taken as input to the heat sink. The thermal performance of the heat sink with PCM is compared with NEPCM for each volume fraction of nano particle for both finned and unfinned configurations. It is observed that the nano particle volume concentration plays a major role in removing the heat from the chip in case of unfinned heat sink configuration. However, for finned heat sink configuration, the volume concentration effect is not appreciable. In addition, the performance of NEPCM based finned heat sink is studied under cyclic loading in both natural and forced convection boundary conditions. It is observed that under forced convection the solidification time is reduced.

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