Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Multi objective optimization of BEoL and fBEOL structure in flip chip package during die attach process

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892320 ◽

2014 ◽

Author(s):

Hardik Parekh ◽

Fahad Mirza ◽

Dereje Agonafer

Keyword(s):

Flip Chip ◽

Multi Objective Optimization ◽

Multi Objective ◽

Die Attach

Transient thermal imaging characterization of a die attached optoelectronic device on silicon

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892431 ◽

2014 ◽

Cited By ~ 1

Author(s):

Kazuaki Yazawa ◽

Dustin Kendig ◽

Kadhair Al-hemyari ◽

Ali Shakouri

Keyword(s):

Thermal Imaging ◽

Optoelectronic Device ◽

Transient Thermal ◽

Imaging Characterization

A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892262 ◽

2014 ◽

Cited By ~ 1

Author(s):

F. Saati Khosroshahi ◽

C.S. Tufekci ◽

M. Arik

Keyword(s):

Experimental Study ◽

Harsh Environment

Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892270 ◽

2014 ◽

Cited By ~ 1

Author(s):

Federica Maggioni ◽

Herman Oprins ◽

Eric Beyne ◽

Ingrid De Wolf ◽

Martine Baelmans

Keyword(s):

Thermal Model ◽

Thermal Impact ◽

Model Application

Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892350 ◽

2014 ◽

Cited By ~ 7

Author(s):

Richard Eiland ◽

John Fernandes ◽

Marianna Vallejo ◽

Dereje Agonafer ◽

Veerendra Mulay

Keyword(s):

Flow Rate ◽

Mineral Oil ◽

Inlet Temperature ◽

Single Server ◽

Direct Immersion

Modeling temperature development of Li-Ion battery packs in hybrid refuse truck operating at different ambient conditions

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892371 ◽

2014 ◽

Author(s):

Paul T. Coman ◽

Christian T. Veje

Keyword(s):

Li Ion Battery ◽

Ambient Conditions ◽

Temperature Development ◽

Battery Packs ◽

Li Ion

Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892314 ◽

2014 ◽

Cited By ~ 5

Author(s):

Joshua Gess ◽

Sushil Bhavnani ◽

Bharath Ramakrishnan ◽

R. Wayne Johnson ◽

Daniel Harris ◽

...

Keyword(s):

Heat Transfer ◽

Form Factor ◽

Boiling Heat Transfer ◽

High Performance ◽

Small Form ◽

Liquid Immersion ◽

Small Form Factor

Experimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892353 ◽

2014 ◽

Cited By ~ 8

Author(s):

Mark Schultz ◽

Michael Gaynes ◽

Pritish Parida ◽

Timothy Chainer

Keyword(s):

Experimental Investigation ◽

Data Center

High heat flux heat pipes embedded in metal core printed circuit boards for LED thermal management

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892291 ◽

2014 ◽

Cited By ~ 1

Author(s):

Dan Pounds ◽

Richard W. Bonner

Keyword(s):

Heat Flux ◽

Thermal Management ◽

Printed Circuit Boards ◽

Heat Pipes ◽

High Heat ◽

High Heat Flux ◽

Circuit Boards ◽

Metal Core ◽

Printed Circuit

Flat heat pipe performance thresholds at ultra-thin form factors

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) ◽

10.1109/itherm.2014.6892326 ◽

2014 ◽

Cited By ~ 1

Author(s):

Yashwanth Yadavalli ◽

Justin A Weibel ◽

Suresh V Garimella

Keyword(s):

Heat Pipe ◽

Form Factors ◽

Flat Heat Pipe

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Multi objective optimization of BEoL and fBEOL structure in flip chip package during die attach process

Transient thermal imaging characterization of a die attached optoelectronic device on silicon

A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications

Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil

Modeling temperature development of Li-Ion battery packs in hybrid refuse truck operating at different ambient conditions

Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model

Experimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center

High heat flux heat pipes embedded in metal core printed circuit boards for LED thermal management

Flat heat pipe performance thresholds at ultra-thin form factors

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Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)Latest Publications

TOTAL DOCUMENTS

H-INDEX

Published By IEEE

Multi objective optimization of BEoL and fBEOL structure in flip chip package during die attach process

Transient thermal imaging characterization of a die attached optoelectronic device on silicon

A computational and experimental study on a harsh environment LED system for vehicle exterior lighting applications

Convolution based compact thermal model application to the evaluation of the thermal impact of die to die interface including interconnections

Flow Rate and inlet temperature considerations for direct immersion of a single server in mineral oil

Modeling temperature development of Li-Ion battery packs in hybrid refuse truck operating at different ambient conditions

Impact of surface enhancements upon boiling heat transfer in a liquid immersion cooled high performance small form factor server model

Experimental investigation of direct attach microprocessors in a Liquid-Cooled chiller-less Data Center

High heat flux heat pipes embedded in metal core printed circuit boards for LED thermal management

Flat heat pipe performance thresholds at ultra-thin form factors

Fourteenth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)
Latest Publications