Passive Thermal Management of Excess Heat from Electronic Devices

1989 ◽  
Vol 154 ◽  
Author(s):  
John J. Glatz ◽  
Juan F. Leon
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Exchanger ◽  
Thermal Management ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Enabling Technology ◽  
Electronic Components ◽  
Potential Applications ◽  
General Scope

AbstractThermal management in the packaging of electronic components is fast becoming an enabling technology in the development of reliable electronics for a range of applications. The objective of the paper is to assess the feasibility of using advance high thermal conductivity pitch fiber (HTCPF) as a solution to some of the packaging problems. The general scope will include the following: identification of the candidate material and its potential applications; thermal management of the chip to board interface; thermal management of the heat within the multi-layer interconnect board (MIB); thermal management of the standard electronic module-format E (SEME); and heat transfer thru the enclosure to a remote heatsink/heat exchanger.

Vapor grown carbon fiber reinforced aluminum composites with very high thermal conductivity

1995 ◽  
Vol 10 (2) ◽  
pp. 247-250 ◽  
Author(s):  
Jyh-Ming Ting ◽  
Max L. Lake
Keyword(s):  
Thermal Conductivity ◽  
Carbon Fiber ◽  
Thermal Management ◽  
Room Temperature ◽  
Electronic Devices ◽  
High Thermal Conductivity ◽  
Aluminum Metal ◽  
Aluminum Metal Matrix Composite ◽  
New Material ◽  
Very High

The first use of continuous vapor grown carbon fiber (VGCF) as reinforcement in aluminum metal matrix composite (Al MMC) is reported. Al MMC represents a new material for thermal management in high-power, high-density electronic devices. Due to the ultrahigh thermal conductivity of VGCF, 1950 W/m-K at room temperature, VGCF-reinforced Al MMC exhibits excellent thermal conductivity that cannot be achieved by using any other carbon fiber as reinforcement. An unprecedented high thermal conductivity of 642 W/m-K for Al MMC was obtained by using 36.5% of VGCF.

Modeling of Radiative and Optical Behavior of Nanofluids Based on Multiple and Dependent Scattering Theories

2005 ◽  
Author(s):  
Ravi S. Prasher ◽  
Patrick E. Phelan
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Base Fluid ◽  
Research Community ◽  
High Thermal Conductivity ◽  
Radiative Properties ◽  
Heat Transfer Fluids ◽  
Scattering Effects ◽  
Potential Applications ◽  
Optical Behavior

There is a lot of interest in the research community about nanofluids due to their high thermal conductivity and potential applications as heat transfer fluids. In this paper we calculate the optical and radiative properties of nanofluids. Results indicate that the radiative properties of nanofluids can be very different from those of the base fluid, suggesting that these properties can be tailored to satisfy specific applications. Results also suggest that multiple and dependent scattering effects can be very dominant in nanofluids.

Binary Particle Mixtures as a Heat Transfer Media in Shell-and-Plate Moving Packed Bed Heat Exchangers

2021 ◽  
Author(s):  
Chase Ellsworth Christen
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Particle Size ◽  
Heat Transfer Coefficient ◽  
Heat Exchanger ◽  
Heat Exchangers ◽  
Packed Bed ◽  
Particle Sizes ◽  
Overall Heat Transfer Coefficient ◽  
Solid Media

Solid particles are being considered in several high temperature thermal energy storage systems and as heat transfer media in concentrated solar power (CSP) plants. The downside of such an approach is the low overall heat transfer coefficients in shell-and-plate moving packed bed heat exchangers caused by the inherently low packed bed thermal conductivity values of the low-cost solid media. Choosing the right particle size distribution of currently available solid media can make a substantial difference in packed bed thermal conductivity, and thus, a substantial difference in the overall heat transfer coefficient of shell-and-plate moving packed bed heat exchangers. Current research exclusively focuses on continuous unimodal distributions of alumina particles. The drawback of this approach is that larger particle sizes require wider particle channels to meet flowability requirements. As a result, only small particle sizes with low packed bed thermal conductivities have been considered for the use in the falling-particle Gen3 CSP concepts. Here, binary particle mixtures, which are defined in this thesis as a mixture of two continuous unimodal particle distributions leading to a continuous bimodal particle distribution, are considered to increase packed bed thermal conductivity, decrease packed bed porosity, and improve moving packed bed heat exchanger performance. This is the first study related to CSP solid particle heat transfer that has considered the packed bed thermal conductivity and moving packed bed heat exchanger performance of bimodal particle size distributions at room and elevated temperatures. Considering binary particle mixtures that meet particle sifting segregation criteria, the overall heat transfer coefficient of shell-and-plate moving packed bed heat exchangers can be increased by 23% when compared to a monodisperse particle system. This work demonstrates that binary particle mixtures should be seriously considered to improve shell-and-plate moving packed bed heat exchangers.

scholarly journals High thermal conductivity polymer chains with reactive groups: a step towards true application

2020 ◽  
Vol 1 (6) ◽  
pp. 1996-2002
Author(s):  
Anqi Chen ◽  
Yanyan Wu ◽  
Shaoxin Zhou ◽  
Wenxue Xu ◽  
Wenlong Jiang ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Polymer Chains ◽  
High Thermal Conductivity ◽  
Reactive Groups

Nanostructured polyethylene (PE, [–CH2–CH2–]n) films with metal-like thermal conductivity have opened up opportunities for polymers in advanced thermal management.

Experimental Investigation of Heat Transfer Enhancement of Shell and Tube Heat Exchanger Using SnO2-Water and Ag-Water Nanofluids

2019 ◽  
Vol 12 (4) ◽  
Author(s):  
S. V. Sridhar ◽  
R. Karuppasamy ◽  
G. D. Sivakumar
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Heat Transfer Coefficient ◽  
Heat Exchanger ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Convective Heat Transfer Coefficient ◽  
Two Phase ◽  
Tube Heat Exchanger ◽  
Shell And Tube

Abstract In this investigation, the performance of the shell and tube heat exchanger operated with tin nanoparticles-water (SnO2-W) and silver nanoparticles-water (Ag-W) nanofluids was experimentally analyzed. SnO2-W and Ag-W nanofluids were prepared without any surface medication of nanoparticles. The effects of volume concentrations of nanoparticles on thermal conductivity, viscosity, heat transfer coefficient, fiction factor, Nusselt number, and pressure drop were analyzed. The results showed that thermal conductivity of nanofluids increased by 29% and 39% while adding 0.1 wt% of SnO2 and Ag nanoparticles, respectively, due to the unique intrinsic property of the nanoparticles. Further, the convective heat transfer coefficient was enhanced because of improvement of thermal conductivity of the two phase mixture and friction factor increased due to the increases of viscosity and density of nanofluids. Moreover, Ag nanofluid showed superior pressure drop compared to SnO2 nanofluid owing to the improvement of thermophysical properties of nanofluid.

Mechanical Properties of Microscale Graphitic Carbon Foam Ligaments and Nodes

2009 ◽  
Author(s):  
S. Ganguli ◽  
A. K. Roy ◽  
R. Wheeler
Keyword(s):  
Thermal Conductivity ◽  
Thermal Management ◽  
Thermal Protection ◽  
Solid Phase ◽  
Coefficient Of Thermal Expansion ◽  
Carbon Foam ◽  
High Thermal Conductivity ◽  
Uniform Size ◽  
Open Cell ◽  
Carbon Foams

Carbon foam is recognized as having the greatest potential to replacement for metal fins in thermal management systems such as heat exchangers, space radiators, and thermal protection systems [1–5]. Carbon foam refers to a broad class of materials that include reticulated glassy, carbon and graphitic foams that are generally open-cell or mostly open-cell. They can be tailored to have low or high thermal conductivity with a low coefficient of thermal expansion and density. These foams have high modulus but low compression and tensile strength. Among the carbon foams, the graphitic foam offers superior thermal management properties such as high thermal conductivity. Graphitic foams are made of a network of spheroidal shell segments. Each cell has thin, stretched ligaments in the walls that are joined at the nodes or junctions. The parallel arrangement of graphene planes in the ligaments confers highly anisotropic properties to the walls of the graphitic foams. The graphene planes tend to be oriented with the plane of the ligaments but become disrupted at the junctions (nodes) of the walls. Since conduction is highest along parallel graphene planes, the thermal conductivity is highest in the plane of the ligaments or struts, and much lower in the direction transverse to the plane of these ligaments. In a previous study [6] extensive mechanical and thermal property characterization of carbon foams from Kopper Inc. (L1) and POCO Graphite, Inc. (P1) were reported. These foams were graphitic ones that are expected to have high thermal conductivity. Figure 1 shows sections of light microscopy images of the three foams of four foams. The most important thing to notice is that the images were not at the same magnification. The large cells in the GrafTech foam have an average diameter of only ∼100 μm but have a bimodal distribution cells with many small closed-cells few micrometers in diameter. Changes in density in the GrafTech foam was accompanied by a change in the large cells’ diameter — larger diameter giving greater porosity and lower density without changing the smaller cells’ sizes that filled the solid phase between the larger bubbles. The POCO foam has a fairly uniform size cell distribution of a few hundred micrometers. The Koppers’ foams show larger cells yet with the left (“L” precursor) having a uniform size while the right-hand (“D” precursor) is a less uniform and lower porosity.

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