scholarly journals Modelling stress relaxation after hot deformation: microstructure-property relationships in Nb-bearing steels

Author(s):  
Jianwei Zhao ◽  
Quan Yang ◽  
Hossein Eskandari Sabzi ◽  
Wei Wen ◽  
Pedro E.J. Rivera-Díaz-del-Castillo
2019 ◽  
Vol 2 ◽  
pp. 52-60 ◽  
Author(s):  
Oleg Markov ◽  
Oleksiy Gerasimenko ◽  
Leila Aliieva ◽  
Alexander Shapoval

It is shown that when modeling the processes of forging and stamping, it is necessary to take into account not only the hardening of the material, but also softening, which occurs during hot processing. Otherwise, the power parameters of the deformation processes are precisely determined, which leads to the choice of more powerful equipment. Softening accounting (processes of stress relaxation) will allow to accurately determine the stress and strain state (SSS) of the workpiece, as well as the power parameters of the processes of deformation. This will expand the technological capabilities of these processes. Existing commercial software systems for modeling hot plastic deformations based on the finite element method (FEM) do not allow this. This is due to the absence in these software products of the communication model of the component deformation rates and stresses, which would take into account stress relaxation. As a result, on the basis of the Maxwell visco-elastic model, a relationship is established between deformation rates and stresses. The developed model allows to take into account the metal softening during a pause after hot deformation. The resulting mathematical model is tested by experiment on different steels at different temperatures of deformation. The process of steels softening is determined using plastometers. It is established experimentally that the model developed by 89 ... 93 % describes the rheology of the metal during hot deformation. The relationship between the components of the deformation rates and stresses is established, which allows to obtain a direct numerical solution of plastic deformation problems without FED iterative procedures, taking into account the real properties of the metal during deformation. As a result, the number of iterations and calculations has significantly decreased.


2005 ◽  
Vol 45 (12) ◽  
pp. 1893-1896 ◽  
Author(s):  
H. BELADI ◽  
P. D. HODGSON ◽  
M. R. BARNETT

2019 ◽  
Vol 768 ◽  
pp. 138454 ◽  
Author(s):  
Yunsheng Wu ◽  
Xuezhi Qin ◽  
Changshuai Wang ◽  
Lanzhang Zhou

2006 ◽  
Vol 21 (10) ◽  
pp. 2653-2659 ◽  
Author(s):  
Fuqian Yang ◽  
Lingling Peng ◽  
Kenji Okazaki

The reliability of microelectronic interconnections depends on hot deformation of solders. In this work, we studied the localized stress relaxation of Sn3.5Ag eutectic alloy using the impression testing in the temperature range of 393–488 K. By incorporating the effect of internal stress in the analysis, we obtained the strain rate-stress exponent of 6.59. The activation energy for the stress relaxation is in the range from 38.6 to 43.8 kJ/mol, which compares well with the estimated activation energy of dislocation pipe diffusion, 46 kJ/mol, in pure tin. This suggests that a single mechanism of dislocation climb limited by dislocation pipe diffusion might be the controlling mechanism for the localized stress relaxation of the Sn3.5Ag eutectic alloy.


2008 ◽  
Vol 37 (8) ◽  
pp. 1356-1359 ◽  
Author(s):  
Wang Ruining ◽  
Xi Zhengping ◽  
Zhao Yongqing ◽  
Qi Yunlian

2014 ◽  
Vol 615 ◽  
pp. 531-537 ◽  
Author(s):  
Ke Hua ◽  
Xiangyi Xue ◽  
Hongchao Kou ◽  
Jiangkun Fan ◽  
Bin Tang ◽  
...  

2018 ◽  
Vol 56 (06) ◽  
pp. 397-406
Author(s):  
E. Kalinowska-Ozgowicz ◽  
S. Kúdela ◽  
K. Lenik ◽  
W. Ozgowicz

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