Optical and Microstructural Characterisations of Pulsed rf Magnetron Sputtered Alumina Thin Film

2013 ◽  
Vol 29 (10) ◽  
pp. 929-936 ◽  
Author(s):  
I. Neelakanta Reddy ◽  
V. Rajagopal Reddy ◽  
N. Sridhara ◽  
S. Basavaraja ◽  
A.K. Sharma ◽  
...  
Keyword(s):  
Thin Film ◽  
Alumina Thin Film ◽  
Pulsed Rf

scholarly journals Detection of Cd<sup>2+</sup> Ions Using Surface Plasmon Coupled Emission on Engineered Silver-α Nano Alumina Thin Film Hybrids

2013 ◽  
Vol 03 (04) ◽  
pp. 27-31 ◽  
Author(s):  
Pradyumna Mulpur ◽  
Sandeep Patnaik ◽  
Avinash Chunduri ◽  
Tanu Mimani Rattan ◽  
Apparao M. Rao ◽  
...  
Keyword(s):  
Thin Film ◽  
Surface Plasmon ◽  
Alumina Thin Film ◽  
Nano Alumina

Deposition of alumina thin film by dual magnetron sputtering: Is it γ-Al2O3?

2011 ◽  
Vol 59 (20) ◽  
pp. 7757-7767 ◽  
Author(s):  
W. Engelhart ◽  
W. Dreher ◽  
O. Eibl ◽  
V. Schier
Keyword(s):  
Thin Film ◽  
Magnetron Sputtering ◽  
Alumina Thin Film

scholarly journals Adsorption of thioether molecules on an alumina thin film

2014 ◽  
Vol 628 ◽  
pp. 111-115 ◽  
Author(s):  
Yi Pan ◽  
Niklas Nilius ◽  
Wolf-Dieter Schneider ◽  
Hans-Joachim Freund
Keyword(s):  
Thin Film ◽  
Alumina Thin Film

RESIDUAL STRESSES IN OBLIQUE INCIDENCE DEPOSITED ALUMINA THIN FILM

2014 ◽  
Vol 21 (02) ◽  
pp. 1450024 ◽  
Author(s):  
LIJUN HE ◽  
CHUAN LI ◽  
XINGZHAO LIU
Keyword(s):  
Thin Film ◽  
Residual Stress ◽  
Residual Stresses ◽  
Film Thickness ◽  
Substrate Temperature ◽  
Deposition Rate ◽  
Growth Parameters ◽  
Testing Temperature ◽  
Alumina Thin Film ◽  
Inclined Angle

Residual stresses of alumina thin film deposited on silicon substrate by using electron beam evaporation with oblique angle deposition (OAD) method are studied. The growth parameters that affect the residual stresses of alumina thin film, such as the substrate temperature, the deposition rate, the film thickness, the inclined angle, and the testing temperature are discussed. The results show that the tensile stress value decreases with the increasing substrate temperature, and the compressive stress value increases with the increasing substrate temperature at various inclined angles. Along with the deposition rate increasing, the residual stress value decreases at various inclined angles. With the increasing film thickness, the residual stress value decreases at various inclined angles. With the increasing testing temperature, the residual stress value increases at various inclined angles. While the alumina thin film residual stress value is small at high inclined angle. By choosing the appropriate film preparation parameters, the alumina thin film residual stress is effectively controlled.

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