Electrical modeling and characterization of through-silicon vias (TSVs) for 3-D integrated circuits

2010 ◽  
Vol 41 (1) ◽  
pp. 9-16 ◽  
Author(s):  
Ioannis Savidis ◽  
Syed M. Alam ◽  
Ankur Jain ◽  
Scott Pozder ◽  
Robert E. Jones ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Through Silicon Vias ◽  
Electrical Modeling ◽  
Silicon Vias

Electrical Modeling and Characterization of Shield Differential Through-Silicon Vias

2015 ◽  
Vol 62 (5) ◽  
pp. 1544-1552 ◽  
Author(s):  
Qijun Lu ◽  
Zhangming Zhu ◽  
Yintang Yang ◽  
Ruixue Ding
Keyword(s):  
Through Silicon Vias ◽  
Electrical Modeling ◽  
Silicon Vias

Fabrication and electrical characterization of high aspect ratio poly-silicon filled through-silicon vias

2012 ◽  
Vol 22 (5) ◽  
pp. 055021 ◽  
Author(s):  
Pradeep Dixit ◽  
Tapani Vehmas ◽  
Sami Vähänen ◽  
Philippe Monnoyer ◽  
Kimmo Henttinen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Electrical Characterization ◽  
Through Silicon Vias ◽  
Poly Silicon ◽  
Silicon Vias

Characterization of thermal stresses in through-silicon vias for three-dimensional interconnects by bending beam technique

2012 ◽  
Vol 100 (4) ◽  
pp. 041901 ◽  
Author(s):  
Suk-Kyu Ryu ◽  
Tengfei Jiang ◽  
Kuan H. Lu ◽  
Jay Im ◽  
Ho-Young Son ◽  
...  
Keyword(s):  
Thermal Stresses ◽  
Three Dimensional ◽  
Through Silicon Vias ◽  
Silicon Vias ◽  
Beam Technique
Sign in / Sign up

Export Citation Format

Share Document