Reliability assessment for solders with a stress buffer layer using ball shear strength test and board-level finite element analysis

2007 ◽  
Vol 47 (9-11) ◽  
pp. 1658-1662 ◽  
Author(s):  
Ming-Chih Yew ◽  
Chan-Yen Chou ◽  
Kuo-Ning Chiang
2014 ◽  
Vol 9 (3) ◽  
pp. 139-150 ◽  
Author(s):  
Ildikó Buocz ◽  
Nikoletta Rozgonyi-Boissinot ◽  
Ákos Török ◽  
Péter Görög

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