2013 3rd IEEE CPMT Symposium Japan
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9781479908776, 9781479927180, 9781479908752
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Growth models of copper filling in through silicon via at different current density

2013 ◽  
Author(s):  
Zhaoyu Wang ◽  
Ping Cheng ◽  
Hong Wang ◽  
Honglei Guo ◽  
Guifu Ding ◽  
...  
Keyword(s):  
Current Density ◽  
Growth Models ◽  
Through Silicon Via

High bandwidth application with Wide I/O memory on 2.5D-IC silicon interposer

2013 ◽  
Author(s):  
Chen-Chao Wang ◽  
Hung-Hsiang Cheng ◽  
Ming-Feng Chung ◽  
Po-Chih Pan ◽  
Chi-Tsung Chiu ◽  
...  
Keyword(s):  
High Bandwidth

Optimal laser condition for laser soldering in cream and ring solder

2013 ◽  
Author(s):  
Risako Kibushi ◽  
Tomoyuki Hatakyeama ◽  
Dai Imai ◽  
Shinji Nakagawa ◽  
Masaru Ishizuka
Keyword(s):  
Laser Soldering ◽  
Laser Condition

Development of high-speed X-ray CT inspection system using X-ray line sensor

2013 ◽  
Author(s):  
Daisuke Suzuki ◽  
Kenji Noguchi ◽  
Takayuki Murakoshi ◽  
Atsushi Teramoto
Keyword(s):  
High Speed ◽  
Inspection System ◽  
X Ray

Novel bonding method using Cu bumps coated with flexible Ag nanoparticle layer formed by squeegee-coating

2013 ◽  
Author(s):  
Weixin Fu ◽  
Jun Mizuno ◽  
Shuichi Shoji ◽  
Takashi Kasahara ◽  
Akiko Okada ◽  
...  
Keyword(s):  
Ag Nanoparticle ◽  
Nanoparticle Layer ◽  
Bonding Method
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