A method to determine critical circuit blocks for electromigration based on temperature analysis

2020 ◽  
Vol 114 ◽  
pp. 113875
Author(s):  
R.O. Nunes ◽  
J.L. Ramirez ◽  
R.L. de Orio
2014 ◽  
Vol 134 (5) ◽  
pp. 486-495 ◽  
Author(s):  
Takeshi Horiguchi ◽  
Kohei Tsukamoto ◽  
Shinji Tominaga ◽  
Tadashi Nishimura ◽  
Hideaki Fujita ◽  
...  

1989 ◽  
Author(s):  
PAUL NELSON ◽  
NORMAN POTI ◽  
JEFFREY STRICKER

2021 ◽  
Vol 322 ◽  
pp. 112626
Author(s):  
Jingjing Qian ◽  
Zijian Zhao ◽  
Qinming Zhang ◽  
Matthew Werner ◽  
Randy Petty ◽  
...  

2014 ◽  
Vol 487 ◽  
pp. 145-148 ◽  
Author(s):  
Rajendaran Vairavan ◽  
Zaliman Sauli ◽  
Vithyacharan Retnasamy

High power light emitting diodes is the new era of lighting due to momentous supremacy in terms of lighting efficacy over traditional lighting systems. The reliability of LED is dependent on its junction temperature. This study confers on the thermal and stress characterization of LED chip with copper cylindrical heat slug through simulation method. The simulation characterization was carried out with Ansys version 11 at ambient temperature of 25°C under natural convection condition. The LED package was powered with input powers of 0.1 W, 0.5 W and 1W .Results indicated that input power influences the junction temperature and stress of LED chip.


1994 ◽  
Vol 150 (1) ◽  
pp. 69-80 ◽  
Author(s):  
So Maruyama ◽  
Nozomu Fujimoto ◽  
Yukio Sudo ◽  
Yoshihiro Kiso ◽  
Hitoshi Hayakawa

Heart Rhythm ◽  
2021 ◽  
Vol 18 (8) ◽  
pp. S171
Author(s):  
Atul Verma ◽  
Lucas V.A. Boersma ◽  
David E. Haines ◽  
Francis E. Marchlinski ◽  
Hugh Calkins ◽  
...  

2016 ◽  
Author(s):  
Takashi Matsumura ◽  
Shoichi Tamura
Keyword(s):  

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