Design, simulation, and experimental characterization of a heaving triboelectric-electromagnetic wave energy harvester

Nano Energy ◽  
2018 ◽  
Vol 50 ◽  
pp. 281-290 ◽  
Author(s):  
Zia Saadatnia ◽  
Ebrahim Esmailzadeh ◽  
Hani E. Naguib
Keyword(s):  
Electromagnetic Wave ◽  
Wave Energy ◽  
Energy Harvester ◽  
Experimental Characterization

Modeling and Experimental Characterization of a Piezoelectric Energy Harvester with a Wind Concentrator Structure

2020 ◽  
Vol 45 (11) ◽  
pp. 9793-9802
Author(s):  
Jiantao Zhang ◽  
Pengyu Wang ◽  
Yiwen Ning ◽  
Wei Zhao ◽  
Xiaobo Zhang
Keyword(s):  
Energy Harvester ◽  
Experimental Characterization ◽  
Piezoelectric Energy

A heaving point absorber-based triboelectric-electromagnetic wave energy harvester: An efficient approach toward blue energy

2018 ◽  
Vol 42 (7) ◽  
pp. 2431-2447 ◽  
Author(s):  
Zia Saadatnia ◽  
Ehsan Asadi ◽  
Hassan Askari ◽  
Ebrahim Esmailzadeh ◽  
Hani E. Naguib
Keyword(s):  
Electromagnetic Wave ◽  
Wave Energy ◽  
Energy Harvester ◽  
Efficient Approach ◽  
Point Absorber

Experimental Characterization of the Reliability of 3-Terminal Dual-Damascene Copper Interconnect Trees

2002 ◽  
Vol 716 ◽  
Author(s):  
C. L. Gan ◽  
C. V. Thompson ◽  
K. L. Pey ◽  
W. K. Choi ◽  
F. Wei ◽  
...  
Keyword(s):  
Stress Conditions ◽  
Experimental Characterization ◽  
Contact Lines ◽  
Tree Structures ◽  
Similar Test ◽  
Dual Damascene ◽  
Copper Interconnect ◽  
Test Conditions

AbstractElectromigration experiments have been carried out on simple Cu dual-damascene interconnect tree structures consisting of straight via-to-via (or contact-to-contact) lines with an extra via in the middle of the line. As with Al-based interconnects, the reliability of a segment in this tree strongly depends on the stress conditions of the connected segment. Beyond this, there are important differences in the results obtained under similar test conditions for Al-based and Cu-based interconnect trees. These differences are thought to be associated with variations in the architectural schemes of the two metallizations. The absence of a conducting electromigrationresistant overlayer in Cu technology, and the possibility of liner rupture at stressed vias lead to significant differences in tree reliabilities in Cu compared to Al.

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