Low-energy O+ ion beam induced chemical vapor deposition using tetraethyl orthosilicate for silicon dioxide film formation

Author(s):  
Satoru Yoshimura ◽  
Satoshi Sugimoto ◽  
Takae Takeuchi ◽  
Kensuke Murai ◽  
Masato Kiuchi
2008 ◽  
Vol 47 (12) ◽  
pp. 8905-8908
Author(s):  
Young Im ◽  
Jung Hee Lee ◽  
Youn-Seoung Lee ◽  
Won-Jun Lee ◽  
Sa-Kyun Rha

2012 ◽  
Vol 111 (3) ◽  
pp. 034101 ◽  
Author(s):  
Kazumasa Kawase ◽  
Akinobu Teramoto ◽  
Hiroshi Umeda ◽  
Tomoyuki Suwa ◽  
Yasushi Uehara ◽  
...  

1993 ◽  
Vol 300 ◽  
Author(s):  
Yasuyuki Saito

ABSTRACTIt was observed that thin metal (catalytic metal: platinum) penetrated into a interface between a chemical vapor deposition (CVD) silicon dioxide film and a Si–implanted electric thermal furnace, on the way to carrying out experiments on alloyed ohmic–metals with Si–implanted electrically conductive n–type GaAs crystal layers in order to obtain stable and uniform ohmic contact electrodes of low specific ohmic contact resistances for metal–semiconductor field–effect–transistor arrays as a observation tool of semi–insulating GaAs–crystal crystallographic uniformity.


Sign in / Sign up

Export Citation Format

Share Document