In this study, we developed a new method to fabricate microcoils with narrow and high aspect ratio coil lines using TSV and UV-LIGA technology in a SU-8 mold. The combination of SU-8 and TSV makes it possible to fabricate microstructures with high aspect ratio. TSV technology resolved the difficulties of electroplating with high aspect ratio. We designed and fabricated microcoils consisiting of coil lines with widths of 15μm and aspect ratio of 2.
Fabrication of High-aspect-ratio Microstructures for LIGA-technology by Sinchrotron Radiation Polymerisation of Thetetraacrylate Monomer