High quality and high aspect ratio processing of multilayer structures with dissimilar material properties by UV laser microjet

2016 ◽  
Author(s):  
Jérémie Diboine ◽  
Pierre Leroux ◽  
Helgi Diehl ◽  
Bernold Richerzhagen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Material Properties ◽  
Dissimilar Material ◽  
Multilayer Structures ◽  
Uv Laser ◽  
High Quality

High aspect ratio, high-quality microholes in PMMA: a comparison between femtosecond laser drilling in air and in vacuum

2014 ◽  
Vol 119 (1) ◽  
pp. 61-68 ◽  
Author(s):  
Bo Xia ◽  
Lan Jiang ◽  
Xiaowei Li ◽  
Xueliang Yan ◽  
Weiwei Zhao ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
Femtosecond Laser ◽  
High Aspect Ratio ◽  
Laser Drilling ◽  
High Quality

High-Aspect-Ratio Laser-Fusion Targets Driven by 24-Beam uv Laser Radiation

1986 ◽  
Vol 56 (19) ◽  
pp. 2048-2051 ◽  
Author(s):  
M. C. Richardson ◽  
P. W. McKenty ◽  
R. L. Keck ◽  
F. J. Marshall ◽  
D. M. Roback ◽  
...  
Keyword(s):  
Laser Radiation ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Laser Fusion ◽  
Uv Laser

scholarly journals High-aspect-ratio Microdrilling with UV Laser Ablation III.

2010 ◽  
Vol 76 (12) ◽  
pp. 1383-1387
Author(s):  
Hirofumi HIDAI ◽  
Sho ITOH ◽  
Hitoshi TOKURA
Keyword(s):  
Laser Ablation ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Uv Laser

Growth of High-Quality, Thickness-Reduced Zeolite Membranes towards N2 /CH4 Separation Using High-Aspect-Ratio Seeds

2015 ◽  
Vol 54 (37) ◽  
pp. 10843-10847 ◽  
Author(s):  
Yi Huang ◽  
Lei Wang ◽  
Zhuonan Song ◽  
Shiguang Li ◽  
Miao Yu
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
High Quality ◽  
Zeolite Membranes

High-aspect-ratio microdrilling of polymers with UV laser ablation: experiment with analytical model

2003 ◽  
Vol 76 (3) ◽  
pp. 385-396 ◽  
Author(s):  
V.N. Tokarev ◽  
J. Lopez ◽  
S. Lazare ◽  
F. Weisbuch
Keyword(s):  
Laser Ablation ◽  
Aspect Ratio ◽  
Analytical Model ◽  
High Aspect Ratio ◽  
Uv Laser ◽  
Ablation Experiment

Modelling of high-aspect ratio microdrilling of polymers with UV laser ablation

2000 ◽  
Vol 168 (1-4) ◽  
pp. 75-78 ◽  
Author(s):  
V.N. Tokarev ◽  
J. Lopez ◽  
S. Lazare
Keyword(s):  
Laser Ablation ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Uv Laser

A modified solution to assess the required strength of exposed backfill in mine stopes

2012 ◽  
Vol 49 (8) ◽  
pp. 994-1002 ◽  
Author(s):  
Li Li ◽  
Michel Aubertin
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Material Properties ◽  
Critical Issue ◽  
Underground Mines ◽  
Practical Solution ◽  
Low Aspect Ratio ◽  
Ground Stability ◽  
Stope Design ◽  
Surface Loads

Backfilling contributes to the improvement of ground stability and reduction of ore dilution in underground mines. A critical issue for backfilled stope design is the required strength for the fill material. A practical solution to address this question was proposed by Mitchell and co-workers for stopes with an exposed face and a high aspect ratio (height H over width B). However, this solution is not directly applicable to stopes with a relatively low aspect ratio (H/B). Its application is also restricted by additional limitations on the strength along the fill–rock interfaces and the load applied on top of the backfill. In this note, the model proposed by Mitchell and co-workers is modified to provide an estimate of the required strength of backfill for various geometries, material properties, and surface loads. The modified Mitchell (MM) solution is validated against experimental results. Sample calculations with the MM solution are also presented and discussed.

scholarly journals High-aspect-ratio Microdrilling with UV Laser Ablation V.

2011 ◽  
Vol 77 (12) ◽  
pp. 1135-1139
Author(s):  
Hirofumi HIDAI ◽  
Sho ITOH ◽  
Hitoshi TOKURA
Keyword(s):  
Laser Ablation ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Uv Laser

The Accuracy of Micro-molds Produced by a UV Laser Induced Polymerization

1994 ◽  
Vol 116 (3) ◽  
pp. 370-376 ◽  
Author(s):  
K. Yamaguchi ◽  
T. Nakamoto ◽  
P. A. Abbay ◽  
S. Mibu
Keyword(s):  
Thin Films ◽  
Aspect Ratio ◽  
Laser Beam ◽  
High Aspect Ratio ◽  
Research Work ◽  
Practical Method ◽  
High Accuracy ◽  
Uv Laser ◽  
Ultraviolet Laser ◽  
Absorption Of Light

This research work deals with the development of a simple and practical method for manufacturing metallic micromachine parts on the order of 0.01–1.0 mm in size. In this method, an ultraviolet laser beam is irradiated onto the surface of a liquid photopolymer material through a mask. The irradiated pattern is then developed to produce a solidified photopolymer mold. Finally, the metallic part is made by an electroforming process. This paper deals with the first process, the making of the photopolymer mold. At first, the accuracy of the mold is estimated by applying the theories of diffraction and absorption of light. Next, the accuracy is examined experimentally. The results show an accuracy of ± 1 μm can be obtained when a proximity transfer of 10 μm between the mask and the photopolymer surface is used. By stacking thin films, thick and high aspect ratio molds with a reasonably high accuracy are made.

Deep-UV, Light-Assisted, Wet Etching of Compound Semiconductors

1983 ◽  
Vol 29 ◽  
Author(s):  
D. V. Podlesnik ◽  
H. H. Gilgen ◽  
R. M. Osgood
Keyword(s):  
Aspect Ratio ◽  
Visible Light ◽  
High Aspect Ratio ◽  
Laser Light ◽  
Uv Light ◽  
Compound Semiconductors ◽  
Wet Etching ◽  
Uv Laser ◽  
Via Holes ◽  
Deep Uv

ABSTRACTDeep-UV, laser-light-assisted, wet etching of compound semiconductors is reported. As ccmpared to results with visible light, the etching rates per unit power density in the ultraviolet are considerably faster; a factor of >30 is seen under typical conditions. A correlation between the UV absorption in different etching solutions and the light-enhanced etching rates is examined. Gratings with 100-nm resolution have been produced and high-aspect-ratio via-holes have been etched.

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