Thermal degradation mechanism of dodecylbenzene sulfonic acid- hydrochloric acid co-doped polyaniline

2009 ◽  
Vol 94 (10) ◽  
pp. 1788-1794 ◽  
Author(s):  
Ting Chen ◽  
Chaofang Dong ◽  
Xiaogang Li ◽  
Jin Gao
Keyword(s):  
Hydrochloric Acid ◽  
Thermal Degradation ◽  
Sulfonic Acid ◽  
Degradation Mechanism ◽  
Thermal Degradation Mechanism ◽  
Doped Polyaniline ◽  
Dodecylbenzene Sulfonic Acid ◽  
Co Doped

Synthesis and thermal degradation mechanism of polyorganocarboranesiloxanes containing m-carboranylmethyl unit

2017 ◽  
Vol 144 ◽  
pp. 304-314 ◽  
Author(s):  
Pingping Lou ◽  
Xuezhong Zhang ◽  
Bozheng Liu ◽  
Xiyin Gao ◽  
Zhijie Zhang ◽  
...  
Keyword(s):  
Thermal Degradation ◽  
Degradation Mechanism ◽  
Thermal Degradation Mechanism

Hydrogen Bonding Effects on the Electrical Properties and Phase Morphology of Polyaniline Blends

2005 ◽  
Vol 13 (4) ◽  
pp. 415-423
Author(s):  
Pan Wei ◽  
Yang Shenglin ◽  
Li Guang ◽  
Jiang Jianming
Keyword(s):  
Electrical Conductivity ◽  
Hydrogen Bonding ◽  
Electrical Properties ◽  
Cluster Size ◽  
Sulfonic Acid ◽  
Carbonyl Groups ◽  
Solution Cast ◽  
Doped Polyaniline ◽  
Dodecylbenzene Sulfonic Acid ◽  
Polyacrylonitrile Copolymer

Blends of dodecylbenzene sulfonic acid-doped polyaniline (PANI-DBSA) with either polyacrylonitrile copolymer (PAN) or polystyrene (PS) were solution cast. The investigation focused on the interaction between the components, the morphology and the resulting electrical conductivity of blends. The results showed that with the same PANI-DBSA content the conductivity of PANI-DBSA/PAN was higher than that of PANI-DBSA/PS. PANI-DBSA was dispersed uniformly in the PAN matrix and its cluster size was rather smaller than in the PS matrix. This is attributed to hydrogen bonding between the carbonyl groups in PAN and the imine groups in PANI, which should lead to better compatibility between PANI-DBSA and PAN.

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