BN-MWCNT/PPS core-shell structured composite for high thermal conductivity with electrical insulating via particle coating

Polymer ◽  
2016 ◽  
Vol 101 ◽  
pp. 168-175 ◽  
Author(s):  
Kiho Kim ◽  
Jooheon Kim
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Core Shell ◽  
Particle Coating

Enhancing the thermoelectric properties of SnTe via introducing PbTe@C core–shell nanostructures

2021 ◽  
Author(s):  
Jingwen Zhang ◽  
song li ◽  
zhengyi zhu ◽  
Zhenwang Wu ◽  
Jiuxing Zhang
Keyword(s):  
Thermal Conductivity ◽  
Seebeck Coefficient ◽  
Thermoelectric Properties ◽  
Hole Concentration ◽  
High Thermal Conductivity ◽  
Concentration Limit ◽  
Core Shell ◽  
Metal Chalcogenides ◽  
Shell Nanostructures ◽  
High Hole Concentration

SnTe is an emerging IV–VI metal chalcogenides, but its low Seebeck coefficient and high thermal conductivity mainly originating from the high hole concentration limit its thermoelectric performance. In this work,...

Cellulose/boron nitride core–shell microbeads providing high thermal conductivity for thermally conductive composite sheets

RSC Advances ◽  
2016 ◽  
Vol 6 (39) ◽  
pp. 33036-33042 ◽  
Author(s):  
Shoji Nagaoka ◽  
Takuma Jodai ◽  
Yoshihiro Kameyama ◽  
Maki Horikawa ◽  
Tomohiro Shirosaki ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Boron Nitride ◽  
High Thermal Conductivity ◽  
Core Shell ◽  
Conductive Network ◽  
Conductive Composite ◽  
Thermally Conductive

Formation of a thermal conductive network in resin sheet hybridized cellulose/BN core–shell microbeads.

Enhanced high thermal conductivity and low permittivity of polyimide based composites by core-shell Ag@SiO2 nanoparticle fillers

2012 ◽  
Vol 101 (1) ◽  
pp. 012903 ◽  
Author(s):  
Yongcun Zhou ◽  
Lu Wang ◽  
Hu Zhang ◽  
Yuanyuan Bai ◽  
Yujuan Niu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
High Thermal Conductivity ◽  
Core Shell ◽  
Sio2 Nanoparticle ◽  
Low Permittivity

Core–shell Cu@rGO hybrids filled in epoxy composites with high thermal conduction

2018 ◽  
Vol 6 (2) ◽  
pp. 257-265 ◽  
Author(s):  
Shaoqing Liu ◽  
Bo Zhao ◽  
Li Jiang ◽  
Yan-Wu Zhu ◽  
Xian-Zhu Fu ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Polymer Composites ◽  
Electronic Packaging ◽  
Thermal Conduction ◽  
High Thermal Conductivity ◽  
Epoxy Composites ◽  
Core Shell ◽  
Filled Polymer

3D core–shell Cu@rGO filled polymer composites with high thermal conductivity for advanced electronic packaging techniques.

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