Determination of cutting parameters for silicon wafer with a Diamond Wire Saw using an artificial neural network
Keyword(s):
Wire Saw
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2017 ◽
Vol 29
(1)
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pp. 260-270
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2020 ◽
Vol 966
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pp. 012101
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2021 ◽
Vol 1024
(1)
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pp. 012080
2009 ◽
Vol 36
(3)
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pp. 4346-4356
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2021 ◽
Vol 102
(2)
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pp. 351-361
Keyword(s):
2014 ◽
Vol 04
(02)
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pp. 78-88
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Keyword(s):