Thermal conductivity measurements on wood materials with transient plane source technique

2015 ◽  
Vol 600 ◽  
pp. 45-51 ◽  
Author(s):  
S. Lagüela ◽  
P. Bison ◽  
F. Peron ◽  
P. Romagnoni
2005 ◽  
Vol 480-481 ◽  
pp. 133-138 ◽  
Author(s):  
J.A. Reglero ◽  
Miguel A. Rodríguez-Pérez ◽  
D. Lehmhus ◽  
M. Windmann ◽  
Jose A. de Saja ◽  
...  

A collection of AlSi7 closed cell foams were fabricated following the powder metallurgical route [1,2], reaching densities between 540 Kg/m3 and 1350 Kg/m3. Thermal conductivity of the samples was determined using the Transient Plane Source technique (TPS) [3,4], and influence of density was estimated. Several models were tested, and the correlation between experimental data and theoretical results was evaluated. Finally, measurements in different directions were performed, revealing the use of the TPS technique as a non-destructive tool to investigate the existence of in-homogeneities derived from the foaming process.


Author(s):  
M. S. SHEKHAWAT ◽  
S. K. TAK ◽  
R. MANGAL

Thermal conductivity and thermal diffusivity of blended clays have been studied with special reference to Ukrainian clay. The blends were made of three different clays available locally in western part of Rajasthan. Thermal conductivity and thermal diffusivity were determined using the transient plane source (TPS) technique at room temperature and normal pressure. It was found that thermal conductivity and thermal diffusivity of the blends reported maximum at temperature 1200° C and near in the values of Ukrainian clay. The thermal conductivity of blend B2 reported maximum value (1.29 W/m-k) in the present study.


2012 ◽  
Vol 510-511 ◽  
pp. 255-260
Author(s):  
Ashari Maqsood

The first measurement of thermal transport properties on the polycrystalline D-Er2Si2O7have been made in the temperature range 77-300K. Both the thermal conductivity and the thermal diffusivity follow modified Euckens law in this temperature region. The Transient Plane Source technique (TPS) has been used to measure thermal conductivity and thermal diffusivity simultaneously.


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