Modeling thermal fatigue cracking in integrated circuits by level sets and the extended finite element method
2003 ◽
Vol 41
(20)
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pp. 2381-2410
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2006 ◽
Vol 195
(37-40)
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pp. 4753-4767
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2001 ◽
Vol 190
(46-47)
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pp. 6183-6200
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2013 ◽
Vol 77
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pp. 40-58
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2001 ◽
Vol 51
(8)
◽
pp. 943-960
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2019 ◽
2013 ◽
Vol 20
(5)
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pp. 1420-1425
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2019 ◽
Vol 104
◽
pp. 102359
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