Pulsed electron-beam annealing of ion-implantation damage

Vacuum ◽  
1980 ◽  
Vol 30 (1) ◽  
pp. 41
1979 ◽  
Vol 50 (2) ◽  
pp. 783-787 ◽  
Author(s):  
A. C. Greenwald ◽  
A. R. Kirkpatrick ◽  
R. G. Little ◽  
J. A. Minnucci

1980 ◽  
Vol 1 ◽  
Author(s):  
T. O. Yep ◽  
R. T. Fulks ◽  
R. A. Powell

ABSTRACTSuccessful annealing of p+ n arrays fabricated by ion-implantation of 11B (50 keV, 1 × 1014 cm-2) into Si (100 has been performed using a broadly rastered, low-resolution (0.25-inch diameter) electron beam. A complete 2" wafer could be uniformly annealed in ≃20 sec with high electrical activation (>75%) and small dopant redistribution (≃450 Å). Annealing resulted In p+n junctions characterized by low reverse current (≃4 nAcm-2 at 5V reverse bias) and higher carrier lifetime (80 μsec) over the entire 2" wafer. Based on the electrical characteristics of the diodes, we estimate that the electron beam anneal was able to remove ion implantation damage and leave an ordered substrate to a depth of 5.5 m below the layer junction.


2006 ◽  
Vol 132 ◽  
pp. 215-219 ◽  
Author(s):  
D. J. Brink ◽  
H. W. Kunert ◽  
J. B. Malherbe ◽  
J. Camassel

1980 ◽  
Vol 9 (3) ◽  
pp. 685-692 ◽  
Author(s):  
W. Tseng ◽  
H. Dietrich ◽  
J. Davey ◽  
A. Christou ◽  
W. T. Anderson

1982 ◽  
Vol 43 (C5) ◽  
pp. C5-411-C5-420 ◽  
Author(s):  
D. Barbier ◽  
A. Laugier ◽  
A. Cachard

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