The effects of ion implantation damage to photonic crystal optomechanical resonators in silicon

Optomechanical resonators were fabricated on a silicon-on-insulator (SOI) substrate that had been implanted with phosphorus donors. The resonators’ mechanical and optical properties were then measured (at 6 kelvin and room temperature) before and after the substrate was annealed. All measured resonators survived the annealing and their mechanical linewidths decreased while their optical and mechanical frequencies increased. This is consistent with crystal lattice damage from the ion implantation causing the optical and mechanical properties to degrade and then subsequently being repaired by the annealing. We explain these effects qualitatively with changes in the silicon crystal lattice structure. We also report on some unexplained features in the pre-anneal samples. In addition, we report partial fabrication of optomechanical resonators with neon ion milling.

Intrinsic color centers in 4H-silicon carbide formed by heavy ion implantation and annealing

We study the generation and transformation of intrinsic luminescent centers in 4H-polytype of silicon carbide via heavy ion implantation and subsequent annealing. Defects induced by the implantation of germanium (Ge) or tin (Sn) have been characterized by photoluminescence (PL) spectra recorded at cryogenic temperatures. We find three predominant but as-yet-unidentified PL signatures (labeled as DI1–3) at the wavelength of 1002.8 nm (DI1), 1004.7 nm (DI2), and 1006.1 nm (DI3) after high dose implantation (> 4 × 1013 cm-2) and high temperature annealing (> 1700○C). The fact that the DI lines co-occur and are energetically close together suggest that they originate from the same defect. Regardless of the implanted ion (Ge or Sn), a sharp increase in their PL intensity is observed when the implantation damage becomes high (vacancy concentration > 1022 cm-3), indicating that the lines stem from an intrinsic defect caused by the damage. By tracking the PL signals after stepwise annealing, we examine how the overall intrinsic defects behave in the temperature range of 500 – 1800○C; the silicon vacancies formed by the implantation transform into either divacancies or antisite-vacancy pairs with annealing at about 1000○C. These spectra signatures are strongly reduced at 1200○C where the so-called TS defects are maximized in luminescence. As a final stage, the DI defects, which are most likely formed of antisites and vacancies, emerge at 1700○C. Our results provide a knowledge on how to incorporate and manipulate the intrinsic luminescent centers in SiC with ion implantation and annealing, paving the way for fully integrated quantum technology employing SiC.

Ni+ and He+ Implantation Effects on the Hardness and Microstructure of Heat-Treated X750 Superalloy

Nickel and Helium ion implantation-induced hardening and microstructural evolution of X750 in the heat-treated (HT) and solution annealed (SA) conditions were investigated using nano-indentation hardness testing and electron microscopy (scanning electron microscopy (SEM) and transmission electron microscopy (TEM)). Irradiation crystal damage up to ψ = 5 dpa was invoked with Ni+ implantation while He+ implantation up to CHe = 5000 appm was performed on samples the HT and SA conditions. The X750 alloy displayed generally increasing hardness with increasing Ni+ implantation damage but a perturbation in the trend occurred when ψ ≤ 0.5 dpa, and the hardness dropped by about 30% and 2% for the HT and the SA samples, respectively. TEM analysis indicated that this softening was associated with disordering and dissolution of the γ′ strengthening phase. The hardening behavior observed at higher implantation damage (ψ = 1 dpa) resulted in reformation of Al/Ti-rich regions within the microstructure phase. The hardness of the X750 increased continuously with increasing implanted He+ up to CHe = 1000 appm. This was associated with the formation of helium bubbles as observed by TEM. Slight drop in hardness in the HT condition at CHe = 5000 appm indicated that high levels of He+ implantation destabilize the γ′ precipitates as was confirmed with TEM observed disappearance of γ′ super-lattice reflections.

High Pressure Processing of Ion Implanted GaN

It is well known that ion implantation is one of the basic tools for semiconductor device fabrication. The implantation process itself damages, however, the crystallographic lattice of the semiconductor. Such damage can be removed by proper post-implantation annealing of the implanted material. Annealing also allows electrical activation of the dopant and creates areas of different electrical types in a semiconductor. However, such thermal treatment is particularly challenging in the case of gallium nitride since it decomposes at relatively low temperature (~800 °C) at atmospheric pressure. In order to remove the implantation damage in a GaN crystal structure, as well as activate the implanted dopants at ultra-high pressure, annealing process is proposed. It will be described in detail in this paper. P-type GaN implanted with magnesium will be briefly discussed. A possibility to analyze diffusion of any dopant in GaN will be proposed and demonstrated on the example of beryllium.

20 kV-Class Ultra-High Voltage 4H-SiC n-IE-IGBTs

We demonstrate 20 kV-class 4H-SiC n-channel implantation and epitaxial (IE)-IGBTs having both low on-state voltage and high blocking characteristics. We fabricated n-IE-IGBTs on a (0001) silicon face with free-standing epitaxial layers. Effective carrier lifetime increased significantly from 0.9 μs to 9.6 μs by a lifetime enhancement process. We used the IE structure to suppress an increase of the surface p+-well concentration, reduce implantation damage at the p+-well, and reduce junction field effect transistor (JFET) region resistance by ion implantation as a counter doping. The n-IE-IGBT at 100 A/cm2 on-state voltage and specific differential on-resistance was 8.2 V and 36.9 mΩcm2, respectively, at room temperature with a 30 V gate voltage. The blocking voltage was 26.8 kV at 45.7 μA.