Relationship between gas separation properties and chemical structure in a series of aromatic polyimides

1988 ◽  
Vol 37 (1) ◽  
pp. 45-62 ◽  
Author(s):  
T.H. Kim ◽  
W.J. Koros ◽  
G.R. Husk ◽  
K.C. O'Brien
2010 ◽  
Vol 365 (1-2) ◽  
pp. 145-153 ◽  
Author(s):  
Mariola Calle ◽  
Angel E. Lozano ◽  
Javier de Abajo ◽  
José G. de la Campa ◽  
Cristina Álvarez

Polymer ◽  
2019 ◽  
Vol 168 ◽  
pp. 199-208 ◽  
Author(s):  
Shuli Wang ◽  
Shengqi Ma ◽  
Hongru He ◽  
Wenming Ai ◽  
Daming Wang ◽  
...  

2010 ◽  
Vol 361 (1-2) ◽  
pp. 22-27 ◽  
Author(s):  
Chengwen Song ◽  
Tonghua Wang ◽  
Huawei Jiang ◽  
Xiuyue Wang ◽  
Yiming Cao ◽  
...  

2013 ◽  
Vol 444 ◽  
pp. 365-377 ◽  
Author(s):  
Chye Yang Soo ◽  
Hye Jin Jo ◽  
Young Moo Lee ◽  
Jeffrey R. Quay ◽  
M. Keith Murphy

e-Polymers ◽  
2008 ◽  
Vol 8 (1) ◽  
Author(s):  
Andreea Irina Cosutchi ◽  
Camelia Hulubei ◽  
Iuliana Stoica ◽  
Marius Dobromir ◽  
Silvia Ioan

AbstractSurface and electrical properties of two flexible and cross-linked epiclon based polyimide films were investigated. Surface tension measurements indicate an increased hydrophobicity due to both isothermal treatment - which induces imidization and cross-linking - and to the chemical structure, characterized by the different number of ether linkages in the polyimide backbone. Morphology of film surfaces, modified by plasma treatment, shows high roughness and, implicitly, improved adhesion, as required in electronics. The studied polyimides exhibit low dielectric constants and dielectric losses, comparatively to conventional aromatic polyimides. The electrical conductance and resistivity characteristics of these polymers recommend them as good insulators for dielectric layers in microelectronic applications.


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