Mechanical and Fracture Properties of Polycrystalline Graphene with Hydrogenated Grain Boundaries

2021 ◽  
Author(s):  
Mohan S. R. Elapolu ◽  
Alireza Tabarraei
Keyword(s):  
Grain Boundaries ◽  
Fracture Properties ◽  
Mechanical And Fracture Properties

Micromechanics Measurements Applied to Integrated Circuit Microelectronics

1997 ◽  
Vol 473 ◽  
Author(s):  
David R. Clarke
Keyword(s):  
Integrated Circuits ◽  
Integrated Circuit ◽  
Fracture Resistance ◽  
Interface Fracture ◽  
New Techniques ◽  
Fracture Properties ◽  
Engineered Structures ◽  
Mechanical And Fracture Properties ◽  
Interconnect Lines ◽  
Metallic Interconnect

ABSTRACTAs in other engineered structures, fracture occasionally occurs in integrated microelectronic circuits. Fracture can take a number of forms including voiding of metallic interconnect lines, decohesion of interfaces, and stress-induced microcracking of thin films. The characteristic feature that distinguishes such fracture phenomena from similar behaviors in other engineered structures is the length scales involved, typically micron and sub-micron. This length scale necessitates new techniques for measuring mechanical and fracture properties. In this work, we describe non-contact optical techniques for probing strains and a microscopic “decohesion” test for measuring interface fracture resistance in integrated circuits.

Friction Stir-Welded Titanium Alloy Ti-6Al-4V: Microstructure, Mechanical and Fracture Properties

JOM ◽  
2015 ◽  
Vol 67 (5) ◽  
pp. 1054-1063 ◽  
Author(s):  
D. G. Sanders ◽  
P. Edwards ◽  
A. M. Cantrell ◽  
K. Gangwar ◽  
M. Ramulu
Keyword(s):  
Titanium Alloy ◽  
Fracture Properties ◽  
Friction Stir ◽  
Mechanical And Fracture Properties
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