Thermally Stable Transparent Sol−Gel Based Siloxane Hybrid Material with High Refractive Index for Light Emitting Diode (LED) Encapsulation

2010 ◽  
Vol 22 (11) ◽  
pp. 3549-3555 ◽  
Author(s):  
Joon-Soo Kim ◽  
SeungCheol Yang ◽  
Byeong-Soo Bae
2013 ◽  
Vol 131 (3) ◽  
pp. n/a-n/a ◽  
Author(s):  
David W. Mosley ◽  
Garo Khanarian ◽  
David M. Conner ◽  
David L. Thorsen ◽  
Tianlan Zhang ◽  
...  

2015 ◽  
Vol 7 (2) ◽  
pp. 1035-1039 ◽  
Author(s):  
Jun-young Bae ◽  
YongHo Kim ◽  
HweaYoon Kim ◽  
YuBae Kim ◽  
Jungho Jin ◽  
...  

RSC Advances ◽  
2016 ◽  
Vol 6 (75) ◽  
pp. 70825-70831 ◽  
Author(s):  
Mei Chen ◽  
Guoyan Zhang ◽  
Xiao Liang ◽  
Wanshu Zhang ◽  
Le Zhou ◽  
...  

A novel active silicone–oligomers used as chemical intermediates in optical applications were synthesized and one of their derivatives, a transparent film with high refractive index, were presented.


Polymers ◽  
2018 ◽  
Vol 10 (9) ◽  
pp. 1006 ◽  
Author(s):  
Minghao Yi ◽  
Xunjun Chen ◽  
Shufang Wu ◽  
Jianfang Ge ◽  
Xinhua Zhou ◽  
...  

Poly(phenyl-substituted siloxanes/silsesquioxanes) are obtained by the Piers–Rubinsztajn (PR) reaction of hydrogen-containing siloxanes (HCS) with diphenyldialkoxysilanes such as diphenyldimethoxysilane and diphenyldiethoxysilane catalyzed by tris(pentafluorophenyl)borane. 29Si nuclear magnetic resonance (NMR) spectroscopy, gel permeation chromatography, and refractive index analysis revealed that apart from phenyl substituents and complex structures such as molecular bridges composed of D2Ph2[(C6H5)2Si(OSi)2], structures also existed in these polymers, having high refractive indexes (above 1.50) and high molecular weights (75.60 KDa·mol−1). As revealed by thermogravimetric analysis, these polymers have high thermal stability as well, with temperature at 5% mass loss (T5%) increasing by 182.5 °C and Rw (residual weight ratio) increasing by 5.17 times from 14.63% to 75.60%, as compared to HCS, exhibiting its potential application as resins for resisting strong heat. Such high-refractive-index and temperature-resistant poly(phenyl-substituted siloxanes/silsesquioxanes) with Si–H and alkoxy functional groups can be used as a good addition-type crosslinking agent with adhesion-promoting properties or a special curing agent that can solidify silicone materials through simultaneous addition and condensation reactions, which has potential application in the light-emitting diode (LED) packaging industry.


RSC Advances ◽  
2013 ◽  
Vol 3 (23) ◽  
pp. 8871 ◽  
Author(s):  
Jun-young Bae ◽  
YongHo Kim ◽  
Hwea-Yoon Kim ◽  
Young-woo Lim ◽  
Byeong-Soo Bae

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