A reversible and highly conductive adhesive: towards self-healing and recyclable flexible electronics

2020 ◽  
Vol 8 (23) ◽  
pp. 7772-7785 ◽  
Author(s):  
Qiming Yan ◽  
Meng Zhou ◽  
Heqing Fu
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Conductive Adhesive ◽  
Self Healing ◽  
Next Generation ◽  
Conductive Adhesives ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

Flexible conductive adhesives are important materials for the next generation of flexible electronic devices.

New insights and perspectives into biological materials for flexible electronics

2017 ◽  
Vol 46 (22) ◽  
pp. 6764-6815 ◽  
Author(s):  
Lili Wang ◽  
Di Chen ◽  
Kai Jiang ◽  
Guozhen Shen
Keyword(s):  
Flexible Electronics ◽  
Electronic Devices ◽  
Biological Materials ◽  
Flexible Electronic ◽  
Critical Components ◽  
Flexible Electronic Devices

Materials based on biological materials are becoming increasingly competitive and are likely to be critical components in flexible electronic devices.

Processable, Ion-Conducting Hydrogel for Flexible Electronic Devices with Self-Healing Capability

2020 ◽  
Vol 53 (24) ◽  
pp. 11130-11141
Author(s):  
Sujoy Das ◽  
Patrick Martin ◽  
Gleb Vasilyev ◽  
Ramesh Nandi ◽  
Nadav Amdursky ◽  
...  
Keyword(s):  
Electronic Devices ◽  
Self Healing ◽  
Flexible Electronic ◽  
Ion Conducting ◽  
Flexible Electronic Devices

A self-healing flexible urea-g-MWCNTs/poly(urethane-sulfide) nanocomposite for sealing electronic devices

2020 ◽  
Vol 8 (2) ◽  
pp. 607-618 ◽  
Author(s):  
Qiming Yan ◽  
Qi Fu ◽  
Jianfeng Hu ◽  
Heqing Fu
Keyword(s):  
Electronic Devices ◽  
Self Healing ◽  
Flexible Electronic ◽  
Flexible Electronic Devices

With the development of flexible electronic devices, strict requirements for sealing these electronics are put forward.

Flexible Electronic Devices From Hot Embossing Materials Transfer

2005 ◽  
Author(s):  
Ashante’ Allen ◽  
Andrew Cannon ◽  
William King ◽  
Samuel Graham
Keyword(s):  
Flexible Electronics ◽  
Low Cost ◽  
Electronic Devices ◽  
Building Blocks ◽  
Transfer Printing ◽  
Flexible Devices ◽  
Planar Surfaces ◽  
Flexible Electronic ◽  
Semiconductor Nanomaterials ◽  
Flexible Electronic Devices

The development of processing methods for flexible electronic devices is seen as an enabling technology for the creation of a new array of semiconductor products. These devices have the potential be low cost, disposable, and can be applied to deformable or non-planar surfaces. While much effort has been put into the development of amorphous silicon and organic semiconductor technology for flexible devices, semiconductor nanomaterials are of interest due to their inherently flexibility, high transport mobilities, and their unique optoelectronic and piezoelectric properties. However, the synthesis of these materials directly onto polymer substrates is not feasible due to the high temperatures or harsh chemical environments under which they are synthesized. This challenge has limited the development of flexible electronics with semiconductor nanomaterial building blocks. A number of techniques which address the manufacturing concerns include solution based processing [1,2] as well as dry transfer techniques [3–5]. In general, dry transfer printing methods carry advantages over solution based processing as the need to address substrate-fluid compatibility is mitigated.

Eco-Friendly, Self-Healing Hydrogels for Adhesive and Elastic Strain Sensors, Circuit Repairing, and Flexible Electronic Devices

2019 ◽  
Vol 52 (6) ◽  
pp. 2531-2541 ◽  
Author(s):  
Zhuo Zhang ◽  
Zhiliang Gao ◽  
Yitong Wang ◽  
Luxuan Guo ◽  
Chaohui Yin ◽  
...  
Keyword(s):  
Elastic Strain ◽  
Electronic Devices ◽  
Strain Sensors ◽  
Self Healing ◽  
Flexible Electronic ◽  
Flexible Electronic Devices
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