Research Progress of Microtransfer Printing Technology for Flexible Electronic Integrated Manufacturing

In recent years, with the rapid development of the flexible electronics industry, there is an urgent need for a large-area, multilayer, and high-production integrated manufacturing technology for scalable and flexible electronic products. To solve this technical demand, researchers have proposed and developed microtransfer printing technology, which picks up and prints inks in various material forms from the donor substrate to the target substrate, successfully realizing the integrated manufacturing of flexible electronic products. This review retrospects the representative research progress of microtransfer printing technology for the production of flexible electronic products and emphasizes the summary of seal materials, the basic principles of various transfer technology and fracture mechanics models, and the influence of different factors on the transfer effect. In the end, the unique functions, technical features, and related printing examples of each technology are concluded and compared, and the prospects of further research work on microtransfer printing technology is finally presented.

Damage of Flexible Electronic Line Under Mechanical and Electrical Stress Loading

Flexible printed circuits (FPCs) are widely used in electronic devices such as movable part line or wearable sensor. Inkjet printing is attracting attention because it can draw electric lines of any shape without a photo mask. The mechanical characteristics such as flexibility or durability of electric lines have been evaluated by bending and tensile tests. Moreover, the reliability characteristics of metal particle ink lines under electric current loading have been recently evaluated. However, the electronic line has not been evaluated under both the mechanical stress due to bending deformation and the electrical stress due to electric current. According to scaling down of electric devices, the current density and Joule heat in interconnect line increase and electromigration (EM) damage becomes a serious problem. EM is a transportation phenomenon of metallic atoms caused by electron wind under high-density electric current. Reducing EM damage is extremely important to enhance device reliability. In this study, high-density current loading tests of flexible electronic line were conducted under bending deformation of the substrate in order to investigate the effect of mechanical stress on the EM damage of the electronic line. As the results of current loading tests, the specimens with bending deformation became open circuits in shorter time than that without bending deformation. Therefore, it is considered that the bending deformation is affected on the electric reliability characteristic of the flexible electronic lines reflecting EM damage.