Finite element analysis of stress relaxation in soft denture liner

2000 ◽  
Vol 27 (8) ◽  
pp. 660-663 ◽  
Author(s):  
Y. Sato ◽  
Y. Abe ◽  
H. Okane ◽  
K. Tsuga
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Relaxation ◽  
Element Analysis ◽  
Soft Denture Liner

Axisymmetric Finite Element Analysis of a Debonded Total Hip Stem With an Unsupported Distal Tip

1996 ◽  
Vol 118 (3) ◽  
pp. 399-404 ◽  
Author(s):  
T. L Norman ◽  
V. C. Saligrama ◽  
K. T. Hustosky ◽  
T. A. Gruen ◽  
J. D. Blaha
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Relaxation ◽  
Bone Cement ◽  
Cement Mantle ◽  
Load Level ◽  
Interface Conditions ◽  
Element Analysis ◽  
Cement Interface ◽  
Total Hip

A tapered femoral total hip stem with a debonded stem-cement interface and an unsupported distal tip subjected to constant axial load was evaluated using two-dimensional (2D) axisymmetric finite element analysis. The analysis was performed to test if the mechanical condition suggest that a “taper-lock” with a debonded viscoelastic bone cement might be an alternative approach to cement fixation of stem type cemented hip prosthesis. Effect of stem-cement interface conditions (bonded, debonded with and without friction) and viscoelastic response (creep and relaxation) of acrylic bone cement on cement mantle stresses and axial displacement of the stem was also investigated. Stem debonding with friction increased maximum cement von Mises stress by approximately 50 percent when compared to the bonded stem. Of the stress components in the cement mantle, radial stresses were compressive and hoop stresses were tensile and were indicative of mechanical taper-lock. Cement mantle stress, creep and stress relaxation and stem displacement increased with increasing load level and with decreasing stem-cement interface friction. Stress relaxation occur predominately in tensile hoop stress and decreased from 1 to 46 percent over the conditions considered. Stem displacement due to cement mantle creep ranged from 614 μm to 1.3 μm in 24 hours depending upon interface conditions and load level.

Axisymmetric, Finite-Element Analysis of Stress Relaxation in Wound Magnetic Tapes

1986 ◽  
Vol 29 (1) ◽  
pp. 75-84 ◽  
Author(s):  
Juan C. Heinrich ◽  
Derry Connolly ◽  
Bharat Bhushan
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Relaxation ◽  
Element Analysis

scholarly journals 531 Finite element analysis in compression and stress relaxation of the liver

2006 ◽  
Vol 2005.18 (0) ◽  
pp. 361-362
Author(s):  
Takahide NAKANISHI ◽  
Manabu TAKAHASHI ◽  
Keiji OGI ◽  
Nagatoshi OKABE
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Relaxation ◽  
Element Analysis

Compressive Stress Relaxation and Nonlinear Finite Element Analysis of Ethylene/Acrylic Vamac® Terpolymer Elastomer (AEM)

2004 ◽  
Author(s):  
Rick D. Fong ◽  
Erol Sancaktar
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Relaxation ◽  
Compressive Stress ◽  
Nonlinear Finite Element Analysis ◽  
Nonlinear Finite Element ◽  
Time Dependency ◽  
Element Analysis ◽  
Shape Factors

The main purpose of this paper is to investigate the time dependency of rubber viscoelastic characteristics at various shape factors (SF) and compression percentages (%), namely Compressive Stress Relaxation (CSR) and Retaining Sealing Force (RSF). Results from nonlinear Finite Element Analysis (FEA) were found corresponding with the static CSR data, which could be used for estimating long term CSR effects of particular products with similar SF and compression % and operation environments.

Comparison of Stresses in Al Lines Under Various Passivations

1997 ◽  
Vol 473 ◽  
Author(s):  
S. Lee ◽  
J. C. Bravman ◽  
P. A. Flinn ◽  
T. N. Marffib
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Stress Relaxation ◽  
High Voltage ◽  
Thermal Stresses ◽  
Test Results ◽  
Element Analysis ◽  
X Ray

ABSTRACTThermal stresses in pure Al lines passivated with a baseline 1000Å oxide and additional passivations of 0.5μm oxide, 1μm polymer, or 0.5μm, 1μm, or 2μ nitride were analyzed. Results from finite element analysis and X-ray measurements were compared, and samples were examined in a high voltage SEM for stress voids. For unvoided samples, calculated and measured results showed good correlation, while results for the voided samples showed little correlation due to stress relaxation through voiding. Initial in-situ electromigration test results showed that electromigration voids can occur at stress void sites.

Sign in / Sign up

Export Citation Format

Share Document