Three-dimensional simulation of void migration at the interface between thin metallic film and dielectric under electromigration

2005 ◽  
Vol 98 (10) ◽  
pp. 103508 ◽  
Author(s):  
T. V. Zaporozhets ◽  
A. M. Gusak ◽  
K. N. Tu ◽  
S. G. Mhaisalkar
2008 ◽  
Vol 128 (2) ◽  
pp. 459-466 ◽  
Author(s):  
Yoshitaka Inui ◽  
Tadashi Tanaka ◽  
Tomoyoshi Kanno

2009 ◽  
Vol 19 (1) ◽  
pp. 75-90 ◽  
Author(s):  
Hong-Bing Xiong ◽  
Jian-Zhong Lin ◽  
Ze-Fei Zhu

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