scholarly journals Lattice Thermal Conductivity of Some Copper Alloys

1957 ◽  
Vol 10 (4) ◽  
pp. 454 ◽  
Author(s):  
WRG Kemp ◽  
PG Klemens ◽  
RJ Tainsh
Keyword(s):  
Thermal Conductivity ◽  
Lattice Thermal Conductivity ◽  
Copper Alloys ◽  
Solute Content ◽  
Zinc Alloys ◽  
Conduction Electrons ◽  
Wide Range ◽  
Electrical Conductivities ◽  
Copper Gold ◽  
Copper Zinc

The thermal and electrical conductivities of three copper-zinc alloys annealed at high temperatures, and of two copper-gold alloys, were measured over a wide range of low temperatures, and their lattice component of thermal conductivity was deduced in the range 2?90 �K. It appears that the high lattice thermal resistance at liquid helium temperatures previously found in copper-zinc alloys is a function of solute content rather than of concentration of conduction electrons and that this resistance can be reduced by high-temperature annealing.

THERMAL AND ELECTRICAL CONDUCTIVITIES OF SOLIDS AT LOW TEMPERATURES

1955 ◽  
Vol 33 (2) ◽  
pp. 58-73 ◽  
Author(s):  
Guy K. White ◽  
S. B. Woods
Keyword(s):  
Thermal Conductivity ◽  
Low Temperatures ◽  
Lattice Thermal Conductivity ◽  
Copper Alloys ◽  
Electrical Conductivities

An apparatus for measuring the thermal and electrical conductivities of solids at temperatures between 2° and 300°K. is described. Results are presented of measurements of some dilute copper alloys, beryllium, bismuth, and germanium. Where possible the lattice thermal conductivity has been deduced, directly or indirectly from the measurements, and its magnitude and variation with temperature are discussed with relation to theory.

scholarly journals A Computational Survey of Semiconductors for Power Electronics

2019 ◽  
Author(s):  
Prashun Gorai ◽  
Robert McKinney ◽  
Nancy Haegel ◽  
Andriy Zakutayev ◽  
Vladan Stevanovic
Keyword(s):  
Thermal Conductivity ◽  
Power Electronics ◽  
Figure Of Merit ◽  
Large Scale ◽  
Lattice Thermal Conductivity ◽  
Consumer Products ◽  
Breakdown Field ◽  
Experimental Investigations ◽  
Wide Range ◽  
Screening Parameter

Power electronics (PE) are used to control and convert electrical energy in a wide range of applications from consumer products to large-scale industrial equipment. While Si-based power devices account for the vast majority of the market, wide band gap semiconductors such as SiC, GaN, and Ga2O3 are starting to gain ground. However, these emerging materials face challenges due to either non-negligible defect densities, or high synthesis and processing costs, or poor thermal properties. Here, we report on a broad computational survey aimed to identify promising materials for future power electronic devices beyond SiC, GaN, and Ga2O3. We consider 863 oxides, sulfides, nitrides, carbides, silicides, and borides that are reported in the crystallographic database and exhibit finite calculated band gaps. We utilize ab initio methods in conjunction with models for intrinsic carrier mobility, and critical breakdown field to compute the widely used Baliga figure of merit. We also compute the lattice thermal conductivity as a screening parameter. In addition to correctly identifying known PE materials, our survey has revealed a number of promising candidates exhibiting the desirable combination of high figure of merit and high lattice thermal conductivity, which we propose for further experimental investigations.

The lattice thermal conductivity of silver alloys between 0.3 and 4°K

1965 ◽  
Vol 257 (1083) ◽  
pp. 385-407 ◽  
Keyword(s):  
Thermal Conductivity ◽  
Lattice Thermal Conductivity ◽  
Phonon Scattering ◽  
Copper Alloys ◽  
Mean Free Path ◽  
Copper Sample ◽  
Phonon Interaction ◽  
Temperature Range ◽  
Electron Phonon Interaction ◽  
Electrical Resistivities

The thermal and electrical conductivities of silver and copper alloys with high electrical resistivities were studied in the temperature range from 0.3 to 4 °K. The lattice thermal conductivity results were interpreted in terms of Pippard’s semi-classical theory of the electron-phonon interaction and good qualitative agreement between this theory and the measurements was obtained for the temperature range from 1 to 4 °K. Below 1 °K the thermal conductivity of most samples decreased much more rapidly than one would have expected if the phonon mean free path were limited by the electron-phonon interaction only. Other phonon scattering mechanisms were therefore postulated and the effects of phonon scattering from dislocations was studied both theoretically and experimentally. The increase in thermal resistance below 1 °K of most alloys was more rapid than the increase obtained theoretically for phonon-dislocation and phonon-boundary scattering. The thermal conductivity of a copper sample with a resistance ratio of about 85 was found to be anomalous below 1 °K as well, suggesting that both the phonons and the conduction electrons could contribute to the effect in the alloys.

Lattice thermal conductivity of copper alloys below 2 K

1976 ◽  
Vol 14 (8) ◽  
pp. 3256-3264 ◽  
Author(s):  
J. L. Vorhaus ◽  
A. C. Anderson
Keyword(s):  
Thermal Conductivity ◽  
Lattice Thermal Conductivity ◽  
Copper Alloys

Analytical Model for Lattice Thermal Conductivity Predictions of Periodic Nanoporous Structures

2016 ◽  
Author(s):  
Qing Hao ◽  
Yue Xiao ◽  
Hongbo Zhao
Keyword(s):  
Thermal Conductivity ◽  
Monte Carlo ◽  
Monte Carlo Simulations ◽  
Lattice Thermal Conductivity ◽  
Phonon Transport ◽  
Kinetic Relationship ◽  
Wide Range ◽  
Edge Scattering ◽  
Bulk Phonon ◽  
Nanoporous Structures

Phonon transport within nanoporous bulk materials or thin films is of importance to applications in thermoelectrics, gas sensors, and thermal insulation materials. Considering classical phonon size effects, the lattice thermal conductivity KL can be predicted assuming diffusive pore-edge scattering of phonons and bulk phonon mean free paths. In the kinetic relationship, kL can be computed by modifying the phonon mean free paths with the characteristic length ΛPore of the porous structure. Despite some efforts using the Monte Carlo ray tracing method to extract ΛPore, the resulting KL often diverges from that predicted by phonon Monte Carlo simulations. In this work, the effective ΛPore is extracted by directly comparing the predictions by the kinetic relationship and phonon Monte Carlo simulations. The investigation covers a wide range of period sizes and volumetric porosities. In practice, these ΛPore values can be used for thermal analysis of general nanoporous materials.

Effect of partial filling of the structural vacant sites on the thermoelectric properties of Zr0.25Hf0.75NiSn half-Heusler alloy

2010 ◽  
Vol 1267 ◽  
Author(s):  
Julien Pierre Amelie Makongo Mangan ◽  
Dinesh Misra ◽  
Nathan J. Takas ◽  
Kevin L. Stokes ◽  
Heike Gabrisch ◽  
...  
Keyword(s):  
Thermal Conductivity ◽  
Composite Materials ◽  
Solid State ◽  
Solid State Reaction ◽  
Lattice Thermal Conductivity ◽  
Strong Reduction ◽  
Partial Filling ◽  
Electrical Conductivities ◽  
Spark Plasma ◽  
Full Heusler

AbstractComposites containing mainly-half-Heusler MNiSn (HH) and full-Heusler MNi2Sn (FH) were prepared by solid state reaction of a mixture of polycrystalline bulk HH alloy with various concentrations of Ni up to 10 wt.%. Electrical conductivities, thermal conductivities and thermopowers of spark plasma sintered specimens of the as synthesized composite materials were measured in the temperature range from 300 K to 750 K. The conduction type of the composite changes from semiconductor to semimetal for Ni concentrations up to 2 wt.% and from semimetal to metal for higher Ni concentrations above 5 wt.%. A strong reduction in lattice thermal conductivity was observed for the composite containing 10 wt. % Ni inclusions.

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