Review of the 9th European Pulse Plating Seminar and EAST Forum 2020

2020 ◽  
Vol 98 (4) ◽  
pp. 167-170
Author(s):  
W. E. G. Hansal ◽  
S. M. Zajkoska
Keyword(s):  
Pulse Plating

scholarly journals Influence of Pulse Current Forward-Reverse Duty Cycle on Structure and Performance of Electroplated W–Cu Composite Coatings

Materials ◽  
2021 ◽  
Vol 14 (5) ◽  
pp. 1233
Author(s):  
Yuchao Zhao ◽  
Nan Ye ◽  
Haiou Zhuo ◽  
Chaolong Wei ◽  
Weiwei Zhou ◽  
...  
Keyword(s):  
Composite Coating ◽  
Duty Cycle ◽  
Electrode Materials ◽  
Pulse Current ◽  
Electrical Discharge Machining ◽  
Composite Coatings ◽  
Electrical Contact ◽  
Pulse Plating ◽  
Fusion Welding ◽  
Raw Material

Tungsten-copper (W–Cu) composites are widely used as electrical contact materials, resistance welding, electrical discharge machining (EDM), and plasma electrode materials due to their excellent arc erosion resistance, fusion welding resistance, high strength, and superior hardness. However, the traditional preparation methods pay little attention to the compactness and microstructural uniformity of W–Cu composites. Herein, W–Cu composite coatings are prepared by pulse electroplating using nano-W powder as raw material and the influence of forward-reverse duty cycle of pulse current on the structure and mechanical properties is systematically investigated. Moreover, the densification mechanism of the W–Cu composite coating is analyzed from the viewpoints of forward-pulse plating and reverse-pulse plating. At the current density (J) of 2 A/dm2, frequency (f) of 1500 Hz, forward duty cycle (df) of 40% and reverse duty cycle (dr) of 10%, the W–Cu composite coating rendered a uniform microstructure and compact structure, resulting in a hardness of 127 HV and electrical conductivity of 53.7 MS/m.

scholarly journals Effects of annealing and pulse plating on soft magnetic properties of electroplated Fe-Ni films

AIP Advances ◽  
2016 ◽  
Vol 6 (5) ◽  
pp. 055923 ◽  
Author(s):  
T. Yanai ◽  
K. Azuma ◽  
K. Eguchi ◽  
Y. Watanabe ◽  
T. Ohgai ◽  
...  
Keyword(s):  
Magnetic Properties ◽  
Pulse Plating ◽  
Soft Magnetic Properties ◽  
Soft Magnetic

scholarly journals Pulse Plating of Copper from Deep Eutectic Solvents

2017 ◽  
Vol 77 (11) ◽  
pp. 1247-1253 ◽  
Author(s):  
Todd Green ◽  
Xiaomeng Su ◽  
Sudipta Roy
Keyword(s):  
Deep Eutectic Solvents ◽  
Pulse Plating

Influence of pulse plating parameters on morphology and hardness of pure tin deposit

2008 ◽  
Vol 86 (2) ◽  
pp. 115-121 ◽  
Author(s):  
W. E. G. Hansal ◽  
M. Halmdienst ◽  
S. Hansal ◽  
I. Boussaboua ◽  
A. Darchen
Keyword(s):  
Pulse Plating ◽  
Tin Deposit
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