ULTRASONIC SYSTEM FOR DETECTING DEFECTS IN IC PACKAGE USING LEAKY LAMB WAVE DEVICE
1992 ◽
Vol 10
(2)
◽
pp. 137-144
◽
2001 ◽
Vol 40
(Part 1, No. 9B)
◽
pp. 5731-5734
◽
1992 ◽
Vol 112
(9)
◽
pp. 575-581
1998 ◽
Vol 37
(Part 1, No. 9B)
◽
pp. 5334-5337
1992 ◽
Vol 91
(3)
◽
pp. 1398-1402
◽
Keyword(s):
1999 ◽
Vol 172
(1)
◽
pp. 105-111
◽
Keyword(s):